Advances in Adhesives, Adhesion Science, and Testing

Damico D

This STP contains papers presented at the Symposium on Advances in Adhesives, Adhesion Science, and Testing held in Washington, DC on October 4, 2004. This symposium focused on new adhesives particularly from the perspective of newer test methods emerging to better determine adhesive reliability.

Areas of particular interest during the symposium included test methods and specifications, bonding and debonding of wood products, methods of measuring viscoelastic behavior of adhesives, accurate methods for measuring yield strength of adhesives and other materials, fracture properties of adhesive joints under impact loading conditions, and coating adhesion testing.

The papers included in this collection provide information on topics such as:

• bond formation
• bond failure, cellular, microscopy
• bond strength
• bond durability
• reactive powder concrete, relative dynamic modulus
• asphalt binder
• asphalt-aggregate interaction
• wood failure of an adhesively bonded block-shear specimen
• strain energy density (SED)
• experimental evaluation of the dynamic fracture properties of an automotive epoxy
• study of interfacial diffusion processes
• use of Adhesive Fracture Mechanics

Purchase this STP to access current research and development information of interest to design engineers and those involved with advanced test methods for adhesive validation.