ASTM STP 1136 Materials Characterization by Thermomechanical Analysis
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Riga, AT
The symposium, Materials Characterization by Thermomechanical Analysis, was presented at ASTM Headquarters on 19-20 March 1990. The symposium was sponsored by ASTM Committee E-37 on Thermal Measurements. This publication contains papers from 15 of the original 25 symposium presentations.
The topic headings used to organize the papers in this collection are Instrumentation, Techniques, and Materials. Specific topics addressed within these general topics include:
- thermal heat distortion
- tensile stress
- thermomechanical analysis (TMA)
- polyethylene terephthalate
- cellulose acetate
- polymer films
- glass transition
- thermomechanical analysis
- dynamic mechanical analysis
- epoxy printed circuit board
- linear variable differential transformer (LVDT)
- coefficient of thermal expansion (CTE)
- dielectric thermal analysis
- high molecular weight poly(ethylene oxide) (PEO)
- penetration/indentation
- organic coatings
- microindentometer
- softening points
- indentation creep
- indentation hardness
- indentation modulus
- computer interfacing
- coefficient of linear thermal expansion (CLTE)
- in-plane CTEs
- out-of-plane CTEs
- ethylene propylene diene terpolymer (EPDM)
- differential scanning calorimetry (DSC)
- asphalt cement
- cracking temperature
- differential scanning calorimetry (DSC)
- FeBSi amorphous alloys
- crystallization
- amorphous metallic ribbons
- structural relaxation
- poly(methyl methacrylate) (PMMA)
- polyethyleneterephthalate (PET)