ASTM STP 1153 Fatigue of Electronic Materials
ASTM STP 1153 is offered by IHS as part of an online subscription to the Special Technical Publications Library.
You may also purchase this publication alone from the IHS Standards Store.
Schroeder, SA
This publication contains papers presented at the Fatigue of Electronic Materials symposium held in May, 1993. The symposium was sponsored by Committee E-8 on Fatigue and Fracture.
Specific topics covered by the papers in this collection include:
- creep fatigue damage
- solder joint
- eutectic tin-lead solder alloys
- unified creep plasticity theory
- thermomechanical fatigue
- high-temperature lead
- lead-free solder joints
- primary creep
- test methodologies
- accelerated thermomechanical fatigue
- high-cycle fatigue
- kovar
- cooled heat-releasing elements
- resistance temperature detectors
- continuum damage mechanics
- finite element method
- austenitic alloys
- grain size
- mean stress
- waveguides
- precision density measurements
- grain boundary sliding
- stress and strain hysteresis response
Purchase this STP if you are interested in materials and system test methods dealing with fatigue in electronic components.