BSI BS EN 50019

Electrical Apparatus for Potentially Explosive Atmospheres - Increased Safety

BSI BS CECC 40101 019

Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level

BSI PD 9002 EDITION 3

Register of Firms, Products and Services Approved under the BS 9000 System Including Information on UK Approvals under the IECQ System (T)

BSI BS 9522 N0003

Detail specification for Multi-contact circular electrical connectors for d.c. and low frequency applications Bayonet coupling non-barrier sealed, environment resistant with rear insertable, rear release, rear removable crimp contacts also barrier sealed with non-removable solder contact styles Full plus airframe fit assessment

BSI BS 9450

Integrated Electronic Circuits and Micro-Assemblies of Assessed Quality (Capability Approval Procedures): Generic Data and Methods of Test-CORR 10184; September 1998

BSI BS 9522

Circular Electrical Connectors of Assessed Quality for d.c. and Low Frequency Applications Full Basic and Full Plus Airframe Assessment Levels

BSI BS 9000 PART 1

General Requirements for Electronic Components of Assessed Quality Part 1: General Procedures

BSI BS 9523

Rules for the Preparation of Detail Specifications for Rectangular Electrical Connectors of Assessed Quality with Integral Metal Housings for d.c. and Low Frequency Applications: Full and Basic Assessment Levels-Amd 1;

BSI BS 9625

Blank Detail Specification for Quartz Crystal Oscillators of Assessed Quality. Full Assessment Level-Supersedes BS 9621: 1979, and BS 9624: 1979

BSI BS 9520

Electrical Connectors of Assessed Quality for d.c. and Low Frequency Application: Generic Data, Methods of Test and Capability Approval Procedures-AMD 7418: February 15, 1993;

BSI BS 4N 100-6

Aircraft oxygen systems and equipment Ð Part 6: Guidance and recommendations on the selection of materials for use with oxygen

BSI BS CECC 30201 001

Tantalum Capacitors with Solid Electrolyte Porous Anode Metal Case: Detail Specification: Basic Plus Additional

BSI BS 4N 100-1

Aircraft oxygen systems and equipment Part 1: Design and installation-AMD 15951: October, 2005

BSI BS 9000 PART 2

General Requirements for a System for Electronic Components of Assessed Quality Part 2: Specification for the National Implementation of the CECC System (T)

BSI BS EN 1888

Child care articles Wheeled child conveyances Safety requirements and test methods-CORR 15023: February 23, 2004; AMD 15885: March 2006; CORR 16519: July 2006; CORR 16707: October 2006; Supersedes BS 7409:1996

BSI PD 9002 EDITION 2

Register of Firms, Products and Services Approved under the BS 9000 System Including Information on UK Approvals under the IECQ System

BSI BS 9524

Rules for the Preparation of Detail Specifications for Rectangular Electrical Connectors of Assessed Quality with Moulded Bodies for d.c. and Low Frequency Applications: Full and Basic Assessment Levels-Amd 1;

BSI BS EN 140401-802

Detail Specification: Fixed low power non wire-wound surface mount (SMD) resistors Rectangular Stability classes 1; 2-AMD 15374:October 8, 2004

BSI BS EN 123000

Add 1 Harmonized System of Quality Assessment for Electronic Components Generic Specification: Printed Boards-AMD 7145: May 1992; AMD 9249: September 1996; Addendum 1: August 15, 1997; Renumbers BS CEC 23000:1989

BSI BS 9522 N0001

Detail Specification for MultiContact Circular Electrical Connectors. Bayonet Coupling with Front Release Rear Removable Crimp Contacts. Full Assessment (AMD 6821) September 30, 1991-Amd 1;

BSI BS EN 4533-002

Aerospace series Fibre optic systems Handbook Part 002: Test and measurement

BSI BS EN 140401

Blank Detail Specification: Fixed Low Power Non-Wire Wound Surface Mounting (SMD) Resistors

BSI BS 4N 100-3

Aircraft oxygen systems and equipment Part 3: Testing of equipment and systems-AMD 14906: March 1, 2004

BSI BS 4N 100-2

Aircraft oxygen systems and equipment Part 2: Tests for the compatibility of materials in the presence of oxygen-AMD 13414: February 4, 2002; AMD 15357: October 31, 2005

BSI BS IEC 60874-10-1

Connectors for Optical Fibres and Cables - Part 10-1: Detail Specification for Fibre Optic Adaptor Type BFOC/2,5 Terminated to Multimode Fibre Type A1

BSI BS EN 123300

Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Multilayer Printed Boards-AMD 9252: September 15, 1996;

BSI BS 123000

System of Quality Assessment - Generic Specification - Printed Boards

BSI BS CECC 90000

Generic Specification: Monolithic Integrated Circuits (AMD 7386) January 15, 1993-Amd 1;

BSI BS 9075 N024

Detail Specification for Fixed Capacitors of Assessed Quality: Monolithic Ceramic Dielectric Type 2C1. Full Assessment-Amd 2;

BSI BS 9720

Custom-Built Transformers and Inductors of Assessed Quality: Generic Data and Methods of Test-AMD 6348: September 30, 1991

BSI BS CECC 00009

Basic Testing Procedures and Measuring Methods for Electromechanical Components: Basic Specification

BSI BS CECC 41300

Low Power Single-Turn Rotary Potentiometers: Sectional Specification

BSI BS EN 60874-1

Connectors for Optical Fibres and Cables - Part 1: Generic Specification

BSI BS EN 187105

Single Mode Optical Cable (Duct/Direct Buried Installation)

BSI BS 9000 PART 3

General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System (T)

BSI DD IEC/TS 62396-1

Process management for avionics Atmospheric radiation effects Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment

BSI BS 123500

System of Quality Assessment - Sectional Specification - Flexible Single-Sided and Double-Sided Printed Boards with Through-Connections

BSI BS 9131 N001-N016

Detail Specification for Lead-Screw Actuated Wirewound or Non-Wirewound Preset Potentiometers Rectangular and Square Forms, Container Sealed, Actuating Device Insulated from Resistive Element, Slipping Clutch at Each End of Travel Full Assessment Level-AMD 4679; April 30, 1985;

BSI BS 9400

Integrated Electronic Circuits and Micro-Assemblies of Assessed Quality: (Qualification Approval Procedures): Generic Data and Methods of Test-AMD 7224 November 15, 1992; Replaced by BS CECC 90000:1985 but Remains Current Due to Existing Approvals;

BSI BS EN ISO 9969

Thermoplastics Pipes - Determination of Ring Stiffness (T)

BSI BS IEC 60874-14-1

Connectors for Optical Fibres and Cables - Part 14-1: Detail Specification for Fibre Optic Connector Type SC-PC Standard Terminated to Multimode Fibre Type A1a, A1b

BSI BS 9125

Capability Approval of Manufacturers of Passive Radio Interference Suppression Filter Units of Assessed Quality Generic Data (AMD 7510) February 15, 1993-Amd 1;

BSI BS 9300 C667-668

Detail Requirements for Silicon Avalanche Rectifier Diodes (Based on Military Specification CV7667-68)

BSI BS 9521

Removable Contacts of Assessed Quality for Electrical Connectors as Defined by BS 9520: Generic Data, Methods of Test and Rules for the Preparation of Detail Specifications-Amd 1;

BSI BS 9525

Rules for the Preparation of Detail Specifications for Two- Part Printed Board Electrical Connectors and Board-Mounted Transition Devices of Assessed Quality for d.c. and l.f. Applications. Full and Basic Assessment Levels (AMD 6609) September 30, 1991-Amd 1;

BSI BS CECC 41200

Power Potentiometers: Sectional Specification

BSI BS CECC 42200

Surge Suppression Varistors

BSI BS EN 60122-1

Quartz crystal units of assessed quality Part 1: Generic specification-Supersedes BS EN 168000;

BSI BS EN 61076-2-102

Connectors for Electronic Equipment Part 2-102: Circular Connectors with Assessed Quality Detail Specification for Plugs and Jacks for External Low Voltage Power Supply

BSI BS 123300

System of Quality Assessment - Sectional Specification - Rigid Multilayer Printed Boards

BSI BS 123300-003

System of Quality Assessment - Capability Detail Specification - Rigid Multilayer Printed Boards

BSI BS 9075 N023

Detail specification for Fixed monolithic ceramic dielectric capacitors (type 1B) Rectangular non-metallic case, centred wires on one face Full assessment level-AMD 7413: January 1993;

BSI BS EN 114000

Generic Specification: Photomultiplier Tubes (AMD 7575) February 15, 1993 (Formerly BS CECC 14000: 1981) (T)-Amd 1;

BSI BS EN 12300

Cryogenic Vessels - Cleanliness for Cryogenic Service-AMD 16379: July 31, 2006

BSI BS EN 132100

Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Fixed Multilayer Cramic Surface Mounting Capacitors Assessment Levels EZ and DZ

BSI BS 9734

Sectional Specification for Pulse Transformers of Assessed Quality for Use in Electronic Equipment: Full Assessment Level (T)

BSI BS CECC 00806

Harmonized System of Quality Assessment for Electronic Components Guide to Total Quality Management (TQM) for CECC-Approved Organizations

BSI BS EN 120001

Blank Detail Specification: Light Emitting Diodes, Light Emitting Diode Arrays, Light Emitting Diode Displays Without Internal Logic and Resistor (AMD 8000) October 15, 1993 (Formerly BS CECC 20001 : 1991. Replaces BS CECC 20001: 1983) (T)-Amd 1;

BSI BS EN 60122-3

Quartz crystal units of assessed quality - Part 3: Standard outlines and lead connections-Supersedes BS 5069-1: 1980

BSI BS EN 60738-1-1

Thermistors - Directly Heated Positive Step-Function Temperature Coefficient - Part 1-1: Blank Detail Specification - Current Limiting Application - Assessment Level EZ-Supersedes BS EN 144001: 1995; IEC 60738-1-1: 1998;

BSI BS QC 301900

Fixed Capacitors for Use in Electronic Equipment Sectional Specification for Fixed Multilayer Ceramic Chip Capacitors (IEC 384-10: 1989) (T)

BSI BS 9073 N0034

Detail Specification for Fixed Capacitors, Tantalum Electrolytic, Porous Anode, Polar, Non-Solid Electrolyte, Tubular Metallic Case, Insulated, PTFE/ Elastomer Seal, Axial Wire Terminations. Full Plus Additional Assessment-Amd 1;

BSI BS 9150

Electrical Relays of Assessed Quality: Generic Data and Methods of Test-Amd 1;

BSI BS EN 100114-1

Rule of Procedure 14 Quality Assessment Procedures Part 1: CECC Requirements for the Approval of an Organization

BSI BS EN 190103

Family Specification: Digital Integrated TTL Low Power SCHOTTKY Circuits Series 54LS, 64LS, 74LS, 84LS (AMD 8370) September 15, 1994 (Formerly BS CECC 90103: 1990 Replaces BS CECC: 90103: 1980 and BS CECC: 90103: 1983) (T)-Amd 3;

BSI BS EN 196000

Generic Specification: Electromechanical Switches-AMD 13530: April 26, 2002;

BSI BS EN 60738-1-2

Thermistors - Directly Heated Positive Step-Function Temperature Coefficient - Part 1-2: Blank Detail Specification - Heating Element Application - Assessment Level EZ-Supersedes BS EN 144002: 1995; IEC 60738-1-2: 1998;

BSI BS EN 60738-1-3

Thermistors - Directly Heated Positive Step-Function Temperature Coefficient - Part 1-3: Blank Detail Specification - Inrush Current Application - Assessment Level EZ-Supersedes BS EN 144003: 1995; IEC 60738-1-3: 1998;

BSI BS ISO/IEC 9805-1

Information Technology - Open Systems Interconnection - Protocol for the Commitment, Concurrency and Recovery Service Element - Part 1: Protocol Specification

BSI BS QC 001002-2

Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) Part 2: Documentation, Including a New Clause on Regulations for Technology Approval Schedules

BSI BS QC 001002-3

Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) Part 3. Approval Procedures, Including a New Clause on Technology Approval

BSI BS QC 160000 PART 2

Electromechanical All-Or-Nothing Relays. Electrical Relays: Generic Specification Part 2: Quality Assessment Procedures

BSI BS QC 960200

Electromechanical Switches for Use in Electronic Equipment Sectional Specification for Lever (Toggle) Switches (IEC 1020-4: 1991)

BSI BS QC 960300

Electromechanical Switches for Use in Electronic Equipment Sectional Specification for Sensitive Switches (IEC 1020-6: 1991)

BSI BS 123700

System of Quality Assessment - Sectional Specification - Flex-Rigid Double-Sided Printed Boards with Through-Connections

BSI BS 9070 N003

Fixed Capacitors of Assessed Quality: Generic Data and Methods of Test N0003: Detail Specification for Fixed Mica Dielectric Capacitors of Assessed Quality: Style C2AEA. General Application Category-Amd 1;

BSI BS 9300 C776-777

Detail Requirements for Germanium Coaxial Mixer Diodes (Based on Military Specification CV7776-77)

BSI BS CECC 23300-003

Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Multilayer Printed Boards-AMD 9807; February, 1998;

BSI BS CECC 30801

Blank Detail Specification: Tantalum Surface Mounting Capacitors

BSI BS CECC 41202

Power Potentiometers (Assessment Level M): Blank Detail Specification

BSI BS CECC 96000

Electromechanical Switches: Generic Specification

BSI BS EN 123200

Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Single and Double Sided Printed Boards with Plated Through Holes-AMD 9251: September 15, 1996;

BSI BS EN 60738-1-4

Thermistors - Directly Heated Positive Step-Function Temperature Coefficient - Part 1-4: Blank Detail Specification - Sensing Application - Assessment Level EZ-Supersedes BS EN 144004: 1995; IEC 60738-1-4: 1998;

BSI BS IEC 60874-10-2

Connectors for Optical Fibres and Cables - Part 10-2: Detail Specification for Fibre Optic Connector Type BFOC/2,5 Terminated to Single-Mode Fibre Type B1

BSI BS ISO/IEC 9314-5

Information Technology Fibre Distributed Data Interface (FDDI) - Part 5: Hybrid Ring Control (HRC) (T)

BSI BS 7039

Recommendations for Dimensions of Spindle Ends and Bushes, and for Dimensions for the Mounting of Single-Hole, Bush-Mounted Spindle-Operated Variable Capacitors, Variable Resistors and Potentiometers for Electronic Equipment

BSI BS 9300

Semiconductor Devices of Assessed Quality: Generic Data and Methods of Test-AMD 7517: February 15, 1993; The BS 9300 Series Replaces BS 3494: Part 1: 1967 and BS 3494: Part 2: 1966. Replaced by BS CECC 50000: 1987 but Remains Current Due to Existing Approvals;

BSI BS 9300 C379-388

Detail Requirements for Silicon Stud Mounted, Power Rectifier Diodes (Based on Military Specification CV7379-88)

BSI BS 9490

Rules for the Preparation of Detail Specifications for Digital Integrated Circuits of Assessed Quality: Full Assessment Level-Amd 3;

BSI BS 9564

Push-Button Switches of Assessed Quality: Generic Data and Methods of Test; General Rules for the Preparation of Detail Specification (AMD 4714) April 28, 1989-Amd 1;

BSI BS CECC 00804

Harmonized System of Quality Assessment for Electronic Components Interpretation of 'EN ISO 9000: 1994' Reliability Aspects for Electronic Components (T)

BSI BS CECC 30500

Fixed Metallized Polycarbonate Film Dielectric Capacitors for Direct Current-Superseded by BS EN 130500: 1998; Supersedes BS 9070: SEC 6: 1971

BSI BS CECC 31100

Sectional Specification: Fixed Ceramic Dielectric Capacitors of Barrier Layer Type (Dielectric Class 3) (AMD 7402) March 15, 1993-Amd 1;

BSI BS CECC 41201

Power Potentiometers (Assessment Level S): Blank Detail Specification

BSI BS CECC 42000

Varistors: Generic Specification (AMD 5590) April 30, 1990-Amd 2;

BSI BS EN 12818

LPG equipment and accessories Inspection and requalification of LPG tanks up to and including 13 m3 underground-AMD 16181: July 31, 2006

BSI BS EN 140400

Harmonized system of quality assessment for electronic components Sectional specification: Fixed low power surface mount (SMD) resistors

BSI BS EN 140401-801

Detail Specification: Fixed Low Power Non Wire-Wound Surface Mount (SMD) Resistors Rectangular Stability Classes 0,1; 0,25; 0,5; 1-AMD 14647: December 9, 2003;

BSI BS EN 165000-1

Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits Part 1: Generic Specification Capability Approval Procedure (T)

BSI BS IEC 60874-14-3

Connectors for Optical Fibres and Cables - Part 14-3: Detail Specification for Fibre Optic Adaptor (Simplex) Type SC for Single-Mode Fibre

BSI BS IEC 60874-14-4

Connectors for Optical Fibres and Cables - Part 14-4: Detail Specification for Fibre Optic Adaptor (Simplex) Type SC for Multimode Fibre

BSI BS ISO/IEC 9804

Information Technology - Open Systems Interconnection - Service Definition for the Commitment, Concurrency and Recovery Service Element

BSI BS N 6

Specification for aeromedical portable oxygen concentrator systems General requirements

BSI BS 9000 PART 5

General Requirements for Electronic Components of Assessed Quality Part 5: Qualification Approval and Conformance Testing Procedures

BSI BS 9030

Magnetrons of Assessed Quality: Generic Data and Methods of Test-Amd 2;

BSI BS 9130

Potentiometers of Assessed Quality: Generic Data and Methods of Test (T)-Amd 2;

BSI BS 9210 N006 PT 2

Detail Specification for Radio Frequency Connectors (Series SMA), 50 ohms, Unsealed, Soldered, Centre Contact, Clamp Outer for Flexible Cables, Solder Outer for Semi-Rigid Cables: Part 2: Control Drawings, Mating Face Details and Gauge Information

BSI BS 9210 N009 PT 1

Detail Specification for Components of Assessed Quality, Soldered Part 1: R.F. Connectors, (Series SMC), Unsealed, Soldered, Captive Contact, 50 Ohms (Screw Coupling) N0009: Full Assessment Level. Ratings, Ordering Information and Inspection Requirement-Amd 1;

BSI BS 9525 N0001

Detail specification for multi-contact two-part printed board electrical connectors-AMD 6856: June 1992;

BSI BS 9751 N0001

Detail specification for fixed insulated (unshielded) radio frequency inductors Wire wound on ferrite, iron dust or phenolic cylindrical former Full assessment level

BSI BS CECC 30601

Fixed Ceramic Dielectric Capacitors. Class 1: Blank Detail Specification (AMD 4551) March 30, 1984-Amd 1;

BSI BS EN 116000-3

Harmonized System of Quality Assessment for Electronic Components Generic Specification: Electromechanical All-or-Nothing Relays Part 3: Test and Measurement Procedures (T)

BSI BS EN 60384-1

Fixed Capacitors for Use in Electronic Equipment Part 1: Generic Specification-Supersedes BS EN 130000:1994

BSI BS EN ISO 14851

Determination of the ultimate aerobic biodegradability of plastic materials in an aqueous medium Method by measuring the oxygen demand in a closed respirometer-AMD 15255:September 3, 2004; Renumbers BS ISO 14851:1999

BSI BS IEC 60874-10-3

Connectors for Optical Fibres and Cables - Part 10-3: Detail Specification for Fibre Optic Adaptor Type BFOC/2,5 for Single and Multimode Fibre

BSI BS IEC 60874-14-5

Connectors for Optical Fibres and Cables - Part 14-5: Detail Specification for Fibre Optic Connector Type SC-PC Untuned Terminated to Single-Mode Fibre Type B1

BSI BS QC 001002

Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) (AMD 7711) June 15, 1993 (T)-Amd 1;

BSI BS QC 160000 PART 1

Electromechanical All-Or-Nothing Relays. Electrical Relays: Generic Specification Part 1: Test and Measurement Procedures

BSI BS QC 160100

Electromechanical All-Or-Nothing Relays. Electrical Relays: Sectional Specification

BSI BS QC 160101

Electromechanical All-Or-Nothing Relays Test Schedules 1, 2, and 3: Blank Detail Specification

BSI BS QC 750005

Voltage-Regulator Diodes and Voltage-Reference Diodes, Excluding Temperature Compensated Precision Reference Diodes

BSI BS QC 750113

Blank Detail Specification Reverse Blocking Triode Thyristors, Ambient and Case-Rated, for Currents Greater Than 100A (In Accordance with BS QC 750100) (T)

BSI BS 9040

Gas-Filled Microwave Switching Tubes of Assessed Quality: Generic Data and Methods of Test

BSI BS 9074 N002

Detail Specification for Fixed Polystyrene Foil Dielectric Capacitors Tubular Insulated Case, Axial Terminations Full Assessment Level (AMD 7411) January 15, 1993-Amd 5;

BSI BS 9074 N007

Polystyrene film dielectric capacitors, extended foil Rectangular non-metallic case, unidirectional terminations Full plus additional assessment level-AMD 3862: December 1981; Supersedes BS 9074 N007: 1978, which remains current due to existing approvals;

BSI BS 9090

Variable Capacitors of Assessed Quality: Generic Data and Methods of Test-Amd 2;

BSI BS 9100

Capability Approval for Custom-Built Capacitors and Capacitor Modules: Generic Data and Methods of Test-AMD 7508: October 15, 1993;

BSI BS 9133

Rules for the Preparation of Detail Specifications for Single Turn Low Power Rotary Potentiometers of Assessed Quality

BSI BS 9151

Rules for the Preparation of Detail Specifications for All-Or-Nothing Electromechanical Relays of Assessed Quality-Amd 2;

BSI BS 9300 C476

Detail Requirements for Silicon Avalanche Rectifier Diode (Based on Military Specification CV7476)

BSI BS 9305 N041

Detail Specification for Voltage Regulator Diodes of Assessed Quality. General Application Category Q. 440 mW, 2.7 to 33 V (5 Per Cent) (Direct Replacements for the CV7009-CV7106 and CV7138-CV7146)

BSI BS 9305 N044

Detail specification for silicon voltage regulator diodes 1.0 W, 3.3 to 33 V (5%), hermetically scaled Full assessment level

BSI BS CECC 00013

Scanning Electron Microscope Inspection of Semiconductor Dice. Basic Specification

BSI BS CECC 00017

Basic Specification: Microwave Common Modules for Use up to 20 GHz. Interfaces, Fixings, Connection Protocol and Module Coding (T)

BSI BS CECC 16100

Electromechanical All-Or-Nothing Relays: Sectional Specification

BSI BS CECC 22000

Generic Specification: Radio Frequency Coaxial Connectors (Parts I, II and III) (T)

BSI BS CECC 22110

Radio Frequency Coaxial Connectors, Series SMA: Sectional Specification

BSI BS CECC 41400

Rotary Precision Potentiometers: Sectional Specification-Amd 1:December 30,1983

BSI BS CECC 90202

Blank Detail Specification: Integrated Operational Amplifiers-AMD 8293 August 15, 1994; Replaces BS CECC 90202: 1985;

BSI BS CECC 96400

Sectional Specification Including Blank Detail Specification: Push- Button Switches

BSI BS EN 116203

Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification: Electromechanical All-or-Nothing Relays for Enhanced Industrial Application

BSI BS EN 116205 THRU 116207

Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification: Hermetically Sealed Relays - for Severe Static Environmental Conditions (116205) for Severe Mobile Environmental Conditions (116206) for Severe Airborne Environmental Conditions (116207)

BSI BS EN 116300

Sectional Specification: Electromechanical All-or-Nothing Heavy Load Relays of Assessed Quality (Rated from 5 A and Above) (T)

BSI BS EN 123500

Harmonized System of Quality Assessment for Electronic Components: Sectional Specification: Flexible Printed Boards with Through Connections-AMD 9574: December 1997; Read in Conjunction with BS EN 123000;

BSI BS EN 130500

Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Fixed Metallized Polycarbonate Film Dielectric Capacitors for Direct Current-Supersedes BS CECC 30500: 1989;

BSI BS EN 13166

Thermal insulation products for buildings Factory made products of phenolic foam (PF) Specification-AMD 15257: July 15, 2004; CORR 16202: April 28, 2006; CORR 16543: July 31, 2006

BSI BS EN 137100

Harmonized System of Quality Assessment for Electronic Components Sectional Spec.: Fixed Aluminium Electrolytic a.c. Capacitors with Non-Solid Electrolyte for Motor Starter Applications - Qualification Approval (T)

BSI BS EN 150001

Blank Detail Specification: General Purpose Semiconductor Diodes (AMD 7590) February 1993 (Formerly BS CECC 50001: 1981 Replaces BS E9371: 1975) (T)-Amd 1;

BSI BS EN 150014

Harmonized system of quality assessment for electronic components Blank detail specification: Thyristor diodes, transient overvoltage suppressors-AMD 9310: January 15, 1997; Renumbers BS CECC 50014: 1995;

BSI BS EN 3155-061

Aerospace series Electrical contacts used in elements of connection Part 061: Contacts, electrical, coaxial, size 12, female, type D, solder, class R Product standard

BSI BS EN 4199-006

Aerospace series Bonding straps for aircraft Part 006: Round braid copper conductors for bonding straps, tin plated up to 150 degrees C or nickel plated up to 260 degrees C Product standard

BSI BS EN 60938-2

Fixed Inductors for Electromagnetic Interference Suppression - Part 2: Sectional Specification-AMD 17010: May 31, 2007

BSI BS EN 61811-50

Electromechanical All-or-Nothing Relays Part 50: Sectional Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality-Supersedes BS EN 116500: 1996;

BSI BS EN 61811-51

Electromechanical All-or-Nothing Relays Part 51: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Non-Standardized Types and Construction-Supersedes BS EN 116501: 1996;

BSI BS QC 200012

Process Assessment Schedule for Printed Board Design Facilities

BSI BS QC 400102

Fixed Low-Power Non-Wirewound Resistors Assessment Level F (IEC 115-2-2: 1992)

BSI BS QC 790132

Bipolar Monolithic Digital Integrated Circuit Gates (Excluding Uncommitted Logic Arrays) (T)

BSI BS QC 960000

Electromechanical Switches for Use in Electronic Equipment Generic Specification (IEC 1020-1: 1991)

BSI BS QC 960501

Electromechanical Switches for Use in Electronic Equipment Blank Detail Specification for in-Line Package Switches (IEC 1020-3-1: 1991)

BSI PD 6460

Collected Amendments to the CV 7000 Specifications for Semiconductors Adopted as British Standards (9300 Series)-Amd 2;

BSI BS 9000 PART 4

General Requirements for a System for Electronic Components of Assessed Quality Part 4: Specification of Procedures for the Approval of an Organization

BSI BS 9000 PART 7

General Requirements for Electronic Components of Assessed Quality Part 7: Lot Formation, Release Procedures and Certified Test Records

BSI BS 9031

Rules for the Preparation of Detail Specifications for Pulsed Fixed-Frequency Magnetrons of Assessed Quality-AMD 1131: March 1973; AMD 1727: April 1975

BSI BS 9070 SEC 5

Fixed Capacitors of Assessed Quality: Generic Data and Methods of Test Section 5: Ceramic Dielectric Capacitors-AMD 7396; March 15, 1993; Superseded by BS CECC 306 & BS CECC 30700;

BSI BS 9070 SEC 6

Fixed Capacitors of Assessed Quality: Generic Data and Methods of Test Section 6: Polycarbonate Dielectric Capacitors and Polyethylene Terephthalate Dielectric Capacitors for d.c. Use and Polypropylene Dielectric Capacitors for d.c. and a.c. Use-AMD 7397; March 15, 1993; Superseded by BS CECC 30100, 30400, 30500, 31200, 31700, 31800;

BSI BS 9076 N001-004

Detail Specification for Fixed Metallized Polyethylene-Metallized Polycarbonate Film Dielectric Capacitors. Rectangular Non-Metallic Case, Axial or Radial Terminations, Centrally Spaced. Full Assessment-Amd 4;

BSI BS 9210 N006 PT 1

Detail Specification for Radio Frequency Connectors of (Series SMA), 50 Ohms, Unsealed, Soldered, Centre Contact, Clamp Outer for Flexible Cables, Solder Outer for Semi-Rigid Cables Part 1: Full Assessment Level Physical Characteristics and Ratings, Together with Inspection Requirements. Climatic Category

BSI BS 9300 C534

Detail Requirements for a Silicon Coaxial Resistive Switching Diode (Based on Military Specification CV7534)

BSI BS 9364 N011

Detail Specification for Low Power P-N-P, 65 V, 500 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation-Amd 1;

BSI BS 9617

Quartz Crystal Units of Assessed Quality: Full Assessment Level-Supersedes BS 9611: 1973, BS 9612: 1973 and BS 9005

BSI BS 9940 PART 05.00

Fixed Resistors for Use in Electronic Equipment Part 05.00: Fixed Resistor Networks in Which Not All Resistors Are Individually Measurable: Sectional Specification

BSI BS CECC 16101

Electromechanical All-Or-Nothing Relays: Blank Detail Specification: Test Schedule 3

BSI BS CECC 41000

Harmonized system of quality assessment for electronic components: Generic specification for potentiometers-AMD 4100: November 1982

BSI BS CECC 50000

Harmonized system of quality assessment for electronic components Generic specification: Discrete semiconductor devices-AMD 7012: October 1992;

BSI BS EN 100114-6

CECC Quality Assessment Procedure for Electronic Components - Part 6: Technology Approval of Manufacturers-AMD 10507; March 2000; Supersedes BS CECC 00114-6: 1994;

BSI BS EN 116204

Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification: Electromechanical All-or- Nothing Sealed Relays for Aggressive Industrial Application

BSI BS EN 122110

Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Radio Frequency Coaxial Connectors Series SMA (T)

BSI BS EN 123400-800

Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards without Through-Connections (AMD 7368) November 15, 1992 (T)-Amd 1;

BSI BS EN 137000

Harmonized System of Quality Assessment for Electronic Components Generic Specification: Fixed Aluminium Electrolytic A.C. Capacitors with Non-Solid Electrolyte for Use with Motors

BSI BS EN 137101

Harmonized System of Quality Assessment for Electronic Components Blank Detail Spec. Fixed AluminiumElectrolytic a.c. Capacitors with Non-Solid Electrolyte for Motor Starter Applications (Qualification Approval) (T)

BSI BS EN 150008

Blank Detail Specification Ambient-Rated Rectifier Diodes-AMD 7698; June 15, 1993; Formerly BS CECC 50008: 1991; Replaces BS CECC 50008: 1982

BSI BS EN 160100

Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Capability Approval of Manufacturers of Printed Board Assemblies of Assessed Quality

BSI BS EN 175101-809

Harmonized system of quality assessment for electronic components Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality

BSI BS EN 186290

Harmonized System of Quality Assessment for Electronic Components Connector Sets for Optical Fibres and Cables - Type MPO

BSI BS EN 190000

Harmonized System of Quality Assessment for Electronic Components Generic Specification: Monolithic Integrated Circuits (T)

BSI BS EN 196500

Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Membrane Switches Including Blank Detail Specification EN 196501-AMD 13458: January 15, 2002;

BSI BS EN 3708-001

Aerospace series Modular interconnection systems Terminal junction systems Part 001: Technical specification

BSI BS EN 4592

Aerospace series Paints and varnishes Test method for determination of infrared reflectance

BSI BS EN 60368-4

Piezoelectric Filters of Assessed Quality - Part 4: Sectional Specification - Capability Approval-IEC 60368-4:2000; Supersedes BS EN 167100:1996;

BSI BS EN 61811-52

Electromechanical All-or-Nothing Relays Part 52: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Two Change-Over Contacts, 20 mm x 10 mm Base-Supersedes BS EN 116502: 1995;

BSI BS QC 222000

Radio-Frequency Connectors RF Coaxial Connectors with Inner Diameter of Outer Conductor 6,5 mm (0,256 in) with Screw Coupling - Characteristic Impedance 50 ohms (Type TNC)

BSI BS QC 420000

Varistors for Use in Electronic Equipment: Generic Specification (IEC 1051-1: 1992) (AMD 7528) January 15, 1993-Amd 1;

BSI BS QC 420100

Varistors for Use in Electronic Equipment: Sectional Specification for Surge Suppression Varistors (IEC 1051-2: 1992)

BSI BS QC 750109

Blank Detail Specification: Rectifier Diodes (Including Avalanche Rectfier Diodes), Ambient and Case-Rated, for Currents Greater Than 100 A (IEC 747-2-2: 1993) (In Accordance with BS QC 750100) (T)

BSI BS QC 790109

Family Specification: HCMOS Digital Integrated Circuits, Series 54/74 IIC, 54/74 HCT, 54/74 HCU (AMD 8377) September 15, 1994 (T)-Amd 1;

BSI BS QC 960101

Harmonized system of quality assessment for electronic components Blank detail specification Electromechanical switches for use in electronic equipment Blank detail specification for rotary switches-IEC 1020-2-1: 1991;

BSI BS QC 960500

Electromechanical Switches for Use in Electronic Equipment Sectional Specification for in-Line Package Switches (IEC 1020-3: 1991)

BSI BS 9000 PART 6

(OBSOLESCENT)1989 General Requirements for Electronic Components of Assessed Quality Part 6: Capability Approval Procedures

BSI BS 9070 SEC 1 & 2

Fixed Capacitors of Assessed Quality: Generic Data and Methods of Test Section 1: Principles and Mandatory Procedures Section 2: General Rules for Drafting Detail Specifications-AMD 7393; March 15, 1993; Superseded by BS CECC 30000;

BSI BS 9120

Radio Interference Suppression Filters of Assessed Quality: Generic Data and Methods of Test (AMD 7509) February 15, 1993 (T)-Amd 1;

BSI BS 9133 N001-003

Detail Specification for Non-Wirewound Single Turn Low Power Rotary Potentiometers of Assessed Quality Full Assessment-AMD 2087: September 30, 1976;

BSI BS 9210 N006 PT 3

Detail Specification for Radio Frequency Connectors of Assessed Quality Part 3: Full Assessment Level. Detail Specification, Parameters

BSI BS 9220 N001

Detail Specification for Rigid Waveguide Tubing, Ordinary Rectangular (2:1) of Assessed Quality General Application Category

BSI BS 9305 N001

Detail specification for silicon voltage regulator diodes 1.5 W, 3.3 to 33 V (5%), hermetically sealed General application category Q

BSI BS 9364 N013

Detail Specification for Low Power P-N-P, 25 V, 300 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation.-Amd 1;

BSI BS 9493

Rules for the Preparation of Detail Specifications for Integrated Circuits of Assessed Quality Which Perform Mixed Digital and/or Analogue Functions

BSI BS 9563

Rotary (Manual) Switches of Assessed Quality: Generic Data and Methods of Test: General Rules for the Preparation of Detail Specifications

BSI BS 9925 PT 02.01&02.02

Inductor and Transformer Cores for Telecommunications Part 02.01 and Part 02.02: Magnetic Oxide Cores for Broad Band Transformers Assessment Levels A and B: Blank Detail Specification

BSI BS CECC 20000

Semiconductor Optoelectronic and Liquid Crystal Devices: Generic Specification-Amd 1;

BSI BS CECC 299 001

Technology Approval Schedule - Manufacture of Electrical Connectors-CECC 299 001:1999;

BSI BS CECC 41101

Preset potentiometers (Assessment Level S): Blank Detail Specification

BSI BS CECC 41102

Preset Potentiometers: Blank Detail Specification: Assessment Level M

BSI BS CECC 63000

Film and Hybrid Integrated Circuits: Generic Specification

BSI BS E9063

Specification for Harmonized system of quality assessment for electronic components: Blank Detail Specification: Industrial Heating Triodes

BSI BS E9065

Specification for Harmonized system of quality assessment for electronic components: Blank detail specification: Small power transmitting tubes of anode dissipation up to 1 kW-CECC 45003:1975

BSI BS EN 100012

Basic Specification: X-Ray Inspection of Electronic Components (T)

BSI BS EN 116200

Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Electromechanical All-or-Nothing Relays (Including Relays for Severe Environmental Conditions)-AMD 9627: October 1997; Renumbers BS CECC 16200:1992

BSI BS EN 119000

Harmonized System of Quality Assessment for Electronic Components Generic Specification Dry and Mercury Wetted Reed Contact Units

BSI BS EN 123400

Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Flexible Printed Boards without Through Connections-AMD 9253: September 15, 1996;

BSI BS EN 123500-800

Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards with Through-Connections (AMD 7370) November 15, 1992 (T)-Amd 1;

BSI BS EN 141101

Blank Detail Specification Lead-Screw Actuated and Rotary Preset Potentiometers-Replaces BS CECC 41101: 1978

BSI BS EN 190100

Harmonized System of Quality Assessment for Electronic Components: Sectional Specification: Digital Monolithic Integrated Circuits (AMD 7845) July 15, 1993 (Formerly BS CECC 90100: 1986 Replaces BS CECC 90100: 1983) (T)-Amd 3;

BSI BS EN 297

Gas-fired central heating boilers Type B11 and B11BS boilers fitted with atmospheric burners of nominal heat input not exceeding 70 kW-AMD 8769: August 1995; AMD 9279: April 1997; AMD 10175: January 1999; AMD 14749: November 26, 2003; AMD 15849: December 8, 2005; CORR 16505: July 31, 2006; Partially supersedes BS 5258-1:1986 and BS 6332-1:1988

BSI BS EN 3155-017

Electrical contacts used in elements of connection - Part 017: Contacts, electrical, relay base, female, type A, crimp, class P Product standard

BSI BS EN 4508

Paints and varnishes Test method for anti slip coatings Determination of the sliding friction behaviour

BSI BS EN 60368-2-2

Piezoelectric Filters - Part 2: Guide to the Use of Piezoelectric Filters - Section 2: Piezoelectric Ceramic Filters-IEC 60368-2-2: 1996;

BSI BS EN 60368-3

Piezoelectric Filters of Assessed Quality - Part 3: Standard Outlines and Lead Connections-IEC 60368-3: 2001; Supersedes BS 5069-2: 1983;

BSI BS EN 60368-4-1

Piezoelectric Filters of Assessed Quality - Part 4-1: Blank Detail Specification - Capability Approval-IEC 60368-4-1: 2000; Supersedes BS EN 167101: 1996;

BSI BS EN 60384-20

Fixed Capacitors for Use in Electronic Equipment - Part 20: Sectional Specification: Fixed Metallized Polyphenylene Sulfide Film Dielectric Surface Mount d.c. Capacitors-IEC 60384-20: 1996;

BSI BS EN 61076-2-101

Connectors for electronic equipment Part 2-101: Circular connectors Detail specification for circular connectors M8 with screw- or snap-locking, M12 with screw-locking for low voltage applications

BSI BS EN 61076-3-112

Connectors for electronic equipment Part 3-112: Rectangular connectors Detail specification for rectangular connectors with four contacts for high performance serial bus for consumer audio/video equipment

BSI BS QC 400600

Harmonized System of Quality Assessment for Electronic Components - Fixed Resistors for Use in Electronic Equipment: Sectional Specification: Fixed Surface Mounting (Chip) Resistors-AMD 13109:June 2001; IEC 60115-8:1989;

BSI BS 9210

Radio Frequency Connectors of Assessed Quality: Generic Data and Methods of Test-AMD 7654; July 15, 1993; Replaced by BS CECC 22000: 1980 but Remains Current Due to Existing Approvals;

BSI BS 9210 N001 PT 1

Radio Frequency Connector (Type BNC), Sealed, Soldered, Captive Content, 50 ohms Part 1: Detail Specification. Full Assessment Level

BSI BS 9300 C199-276

Detail Requirements for Silicon Voltage-Regulator Diodes

BSI BS 9300 C582-584

Electronic parts of assessed quality Reverse blocking triode thyristors-Issue 1;

BSI BS 9364 N007 & N009

Detail Specification for Low Power N-P-N, 20 V, 300 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation (CV 8615 and CV 8616)-Amd 1;

BSI BS 9364 N016

Detail Specification for Low Power N-P-N, 65 V, 600 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation.-Amd 1;

BSI BS 9940-01.0

Harmonized system of quality assessment for electronic components Fixed resistors for use in electronic equipment Part 01.0: Sectional specification: Fixed low power non-wirewound resistors-IEC 115-2: 1982; QC 400100: 1982;

BSI BS CECC 00800

Code of Practice for the Use of the ppm Approach in Association with the CECC System (T)

BSI BS CECC 200025

Harmonized System of Quality Assessment for Electronic Components; Process Assessment Schedule: Printed Board Assembly Facilities

BSI BS CECC 30300

Sectional Specification: Aluminium Electrolytic Capacitors with Solid and Non-Solid Electrolyte-Superseded by BS EN 130300: 1998

BSI BS CECC 30700

Sectional Specification: Fixed Capacitors of Ceramic Dielectric, Class 2-AMD 7401; February 15, 1993; Supersedes BS 9070: SEC 5: 1971

BSI BS CECC 30701

Blank Detail Specification: Fixed Capacitors of Ceramic Dielectric, Class 2 (Assessment Level E)

BSI BS CECC 40300

Fixed Precision Resistors: Sectional Specification

BSI BS CECC 41100

Lead Screw Actuated and Rotary Preset Potentiometers: Sectional Specification-Amd 1:December 23,1987

BSI BS EN 116000-2

Generic Specification: Electromechanical All-or-Nothing Relays Part 2: Generic Data and Methods of Test for Time Delay Relays-AMD 8070: February 15, 1994; Renumbers BS CECC 16000-2:1986

BSI BS EN 150012

Blank Detail Specification: Single Gate Field-Effect Transistors (AMD 7593) February 1993 (Formerly BS CECC 50012: 1978) (T)-Amd 2;

BSI BS EN 190101

Family Specification: Digital Integrated TTL Circuits Series 54, 64, 74, 84, (AMD 8378) September 15, 1994 (Formerly BS CECC 90101: 1990 Replaces BS CECC: 90101: 1980) (T)-Amd 2;

BSI BS EN 3668

Aerospace series - Heat resisting alloy NI-PH2301 (NiCr21Fe18Mo9) - Non heat treated - Forging stock - a or D < or = to 250 mm

BSI BS EN 3716-002

Aerospace series Connectors, single-way with triaxial interface, for transmission of digital data Part 002: Conditions of use and list of product standards

BSI BS EN 60384-20-1

Fixed Capacitors for Use in Electronic Equipment - Part 20: Blank Detail Specification: Fixed Metallized Polyphenylene Sulfide Film Dielectric Surface Mount d.c. Capacitors - Assessment Level EZ-IEC 60384-20-1: 1996;

BSI BS EN 60603-2

Harmonized system of quality assessment for electronic components - Connectors for Frequencies Below 3 MHz for Use with Printed Boards - Part 2: Detail Specification for Two-Part Connectors with Assessed Quality, for Printed Boards, for Basic Grid of 2,54 mm (0,1 in) with Common Mounting Features-AMD 15818: March 2006

BSI BS EN 60938-2-1

Fixed Inductors for Electromagnetic Interference Suppression - Part 2-1: Blank Detail Specification - Inductors for Which Safety Tests Are Required - Assessment Level D-Supersedes BS EN 138101: 1997; IEC 60938-2-1: 1999;

BSI BS EN 60938-2-2

Fixed Inductors for Electromagnetic Interference Suppression - Part 2-2: Blank Detail Specification - Inductors for Which Safety Tests Are Required (Only)-IEC 60938-2-2: 1999;

BSI BS EN 61076-2

Connectors for Use in d.c. Low-Frequency Analogue and Digital High-Speed Data Applications - Part 2: Circular Connectors with Assessed Quality - Sectional Specification-IEC 61076-2: 1998;

BSI BS EN 61811-53

Electromechanical All-or-Nothing Relays Part 53: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Two Change-Over Contacts, 14 mm x 9 mm Base-Supersedes BS EN 116503: 1996;

BSI BS EN 61811-54

Electromechanical all-or-nothing relays Part 54: Blank detail specification Electromechanical all-or-nothing telecom relays of assessed quality Two change-over contacts, 15 mm x 7,5 mm base-Supersedes BS EN 116504:1996

BSI BS ISO 22072

Electrohydrostatic actuator (EHA) Characteristics to be defined in procurement specifications

BSI BS ISO 8913

Aerospace - Lightweight polytetrafluoroethylene (PTFE) hose assemblies, classification 400°F/3 000 psi (204°C/20 684 kPa) and 204°C/21 000 kPa (400°F/3 046 psi) - Procurement specification

BSI BS QC 410100

Potentiometers for Use in Electronic Equipment Sectional Specification: Lead Screw Actuated and Rotary Preset Potentiometers

BSI BS QC 960201

Blank Detail Specification Electromechanical Switches for Use in Electronic Equipment Blank Detail Specification for Lever (Toggle) Switches-IEC 1020-4-1: 1991

BSI BS 123100-003

System of Quality Assessment - Capability Detail Specification - Rigid Single-Sided and Double-Sided Printed Boards with Plain Holes

BSI BS 123500-003

System of Quality Assessment - Capability Detail Specification - Flexible Single-Sided and Double-Sided Printed Boards with Through-Connections

BSI BS 123800

System of Quality Assessment - Sectional Specification - Flexible Multilayer Printed Boards with Through-Connections

BSI BS 9032

Rules for the Preparation of Detail Specifications for Pulsed Magnetrons (Excluding Frequency- Agile Magnetrons) of Assessed Quality. Basic Assessment Level

BSI BS 9050

Cathode Ray Tubes of Assessed Quality. Generic Data and Methods of Test-AMD 1137: April 1973; AMD 1628: February 1975; AMD 2266: September 1977

BSI BS 9153

All-Or-Nothing Electromechanical Relays of Assessed Quality Primarily Intended for Telecommunication Applications: Full and Basic Assessment Levels-Amd 1;

BSI BS 9220 N002

Detail Specification for Medium Flat Rectangular Waveguide (4:1) of Assessed Quality. General Application Category

BSI BS 9300 C771-772

Detail Requirements for Coaxial Mixer Diodes (Based on Military Specification CV7771-2)

BSI BS 9300 C780-831

Detail Requirements for Silicon Voltage Regulator Diodes (Based on Military Specification CV7780- 7831)

BSI BS 9300 C841-849

Detail Requirements for Silicon Voltage Regulator Diodes (Based on Military Specification CV7841- 7849)

BSI BS 9364 N008 & N010

Detail Specification for Low Power N-P-N, 20 V, 300 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation

BSI BS 9526 N0002

Detail Specification for Multi-Contact Edge Socket Electrical Connectors, Single or Double Sided, Open Ended with Metal Fixing Flanges, Guide Key Location, Replaceable Contacts and Through-Board Solder or Wire-Warp Terminations

BSI BS 9561

Lever Operated Switches of Assessed Quality: Generic Data and Methods of Test: General Rules for the Preparation of Detail Specifications (AMD 4711) April 28, 1989-Amd 1;

BSI BS 9612 N005

Detail Specification for Cold-Welded Quartz Crystal Units of Assessed Quality for Oscillator Applications. Frequency Ranges 0.8 to 20 MHz, and 3 to 30 MHz, Narrow Temperature Range

BSI BS 9612 N006

Detail Specification for Cold-Welded Quartz Crystal Units of Assessed Quality for Oscillator Applications. Frequency Range 17 to 75 MHz, Wide Temperature Range

BSI BS 9741

Sectional Specification for Inductors of Assessed Quality for Use in Electronic Equipment for Capability Approval

BSI BS 9750

Fixed Radio Frequency Inductors of Assessed Quality: Generic Data and Methods of Test

BSI BS 9925 PART 0

Inductor and Transformer Cores for Telecommunications Part 0: Generic Specification

BSI BS 9925 PART 03.0

Inductor and Transformer Cores for Telecommunications Part 03.0: Magnetic Oxide Cores for Transformers and Chokes for Power Applications

BSI BS 9940 PART 04.0

Fixed Resistors for Use in Electronic Equipment Part 04.0: Fixed Resistor Networks with Individually Measurable Resistors: Sectional Specification (AMD 5916) September 29, 1989-Amd 1;

BSI BS 9940 PART 04.02

Fixed Resistors for Use in Electronic Equipment Part 04.2: Fixed Resistor Networks with Individually Measurable Resistors of Either Different Resistance Values or Different Rated Dissipators: Blank Detail Spec. Assessment Level E

BSI BS CECC 00016

Basic Specification: Basic Requirements for the Use of Statistical Process Control (SPC) in the CECC System (T)

BSI BS CECC 00109

Rule of Procedure 9 Certified Test Records

BSI BS CECC 00111 PT 2

Rule of Procedure 11 Specifications Part 2: Regulations for CECC Specifications for Components of Enhanced Assessment of Quality

BSI BS CECC 00111 PT 4

Rule of Procedure 11 Specifications Part 4: Regulations for CECC Detail Specifications (AMD 7734) May 15, 1993 (T)-Amd 2;

BSI BS CECC 00111 PT 8

Rule of Procedure 11 Specifications Part 8: Regulations for Technology Approval Schedules (TAS) (T)

BSI BS CECC 00112 PT 2

Rule of Procedure 12 Voting Procedures Part 2: CECC European Standards (T)

BSI BS CECC 00114 PT 3

Rule of Procedure 14 Quality Assessment Procedures Part 3: Capability Approval of an Electronic Component Manufacturing Activity (AMD 8473) March 15, 1995 (T)-Amd 2;

BSI BS CECC 00802

Guidance Document: CECC Standard Method for the Specification of Surface Mounting Components (SMDs) of Assessed Quality (T)

BSI BS CECC 00808

Harmonized System of Quality Assessment for Electronic Components Guidance Document: Use and Application of Plastic Encapsulated Devices (T)

BSI BS CECC 123400-003

Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards Without Through-Connections-AMD 9198 December 15,1996;

BSI BS CECC 16000 PT 1

Generic Specification: Electromechanical All-or-Nothing Relays Part 1: General-Supersedes BS CECC 16000:1980

BSI BS CECC 23100-003

Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double Sided Printed Boards with Plain Holes-AMD 9805; February, 1998;

BSI BS CECC 23300-801

Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Multi-Layer Printed Boards-Supersedes BS EN 123300-800: 1992;

BSI BS CECC 25300

Magnetic Oxide Cores for Power Applications: Sectional Specification-Amd 1:September 30,1982

BSI BS CECC 30401

Fixed Metallized Polyethylene Terephthalate Film Dielectric d.c. Capacitors: Blank Detail Specification

BSI BS CECC 30600

Harmonized system of quality assessment for electronic components: Sectional specification: Fixed ceramic capacitors, Type 1-AMD 5983: July 1992;

BSI BS CECC 30702

Blank Detail Specification: Fixed Capacitors of Ceramic Dielectric, Class 2 (Assessment Level P. Telecom Level)