|
BSI BS EN 50019 |
Electrical Apparatus for Potentially Explosive Atmospheres - Increased Safety |
|
BSI BS CECC 40101 019 |
Fixed Low Power Non- Wirewound Resistors, Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level |
|
BSI PD 9002 EDITION 3 |
Register of Firms, Products and Services Approved under the BS 9000 System Including Information on UK Approvals under the IECQ System (T) |
|
BSI BS 9522 N0003 |
Detail specification for Multi-contact circular electrical connectors for d.c. and low frequency applications Bayonet coupling non-barrier sealed, environment resistant with rear insertable, rear release, rear removable crimp contacts also barrier sealed with non-removable solder contact styles Full plus airframe fit assessment |
|
BSI BS 9450 |
Integrated Electronic Circuits and Micro-Assemblies of Assessed Quality (Capability Approval Procedures): Generic Data and Methods of Test-CORR 10184; September 1998 |
|
BSI BS 9522 |
Circular Electrical Connectors of Assessed Quality for d.c. and Low Frequency Applications Full Basic and Full Plus Airframe Assessment Levels |
|
BSI BS 9000 PART 1 |
General Requirements for Electronic Components of Assessed Quality Part 1: General Procedures |
|
BSI BS 9523 |
Rules for the Preparation of Detail Specifications for Rectangular Electrical Connectors of Assessed Quality with Integral Metal Housings for d.c. and Low Frequency Applications: Full and Basic Assessment Levels-Amd 1; |
|
BSI BS 9625 |
Blank Detail Specification for Quartz Crystal Oscillators of Assessed Quality. Full Assessment Level-Supersedes BS 9621: 1979, and BS 9624: 1979 |
|
BSI BS 9520 |
Electrical Connectors of Assessed Quality for d.c. and Low Frequency Application: Generic Data, Methods of Test and Capability Approval Procedures-AMD 7418: February 15, 1993; |
|
BSI BS 4N 100-6 |
Aircraft oxygen systems and equipment àPart 6: Guidance and recommendations on the selection of materials for use with oxygen |
|
BSI BS CECC 30201 001 |
Tantalum Capacitors with Solid Electrolyte Porous Anode Metal Case: Detail Specification: Basic Plus Additional |
|
BSI BS 4N 100-1 |
Aircraft oxygen systems and equipment Part 1: Design and installation-AMD 15951: October, 2005 |
|
BSI BS 9000 PART 2 |
General Requirements for a System for Electronic Components of Assessed Quality Part 2: Specification for the National Implementation of the CECC System (T) |
|
BSI BS EN 1888 |
Child care articles Wheeled child conveyances Safety requirements and test methods-CORR 15023: February 23, 2004; AMD 15885: March 2006; CORR 16519: July 2006; CORR 16707: October 2006; Supersedes BS 7409:1996 |
|
BSI PD 9002 EDITION 2 |
Register of Firms, Products and Services Approved under the BS 9000 System Including Information on UK Approvals under the IECQ System |
|
BSI BS 9524 |
Rules for the Preparation of Detail Specifications for Rectangular Electrical Connectors of Assessed Quality with Moulded Bodies for d.c. and Low Frequency Applications: Full and Basic Assessment Levels-Amd 1; |
|
BSI BS EN 140401-802 |
Detail Specification: Fixed low power non wire-wound surface mount (SMD) resistors Rectangular Stability classes 1; 2-AMD 15374:October 8, 2004 |
|
BSI BS EN 123000 |
Add 1 Harmonized System of Quality Assessment for Electronic Components Generic Specification: Printed Boards-AMD 7145: May 1992; AMD 9249: September 1996; Addendum 1: August 15, 1997; Renumbers BS CEC 23000:1989 |
|
BSI BS 9522 N0001 |
Detail Specification for MultiContact Circular Electrical Connectors. Bayonet Coupling with Front Release Rear Removable Crimp Contacts. Full Assessment (AMD 6821) September 30, 1991-Amd 1; |
|
BSI BS EN 4533-002 |
Aerospace series Fibre optic systems Handbook Part 002: Test and measurement |
|
BSI BS EN 140401 |
Blank Detail Specification: Fixed Low Power Non-Wire Wound Surface Mounting (SMD) Resistors |
|
BSI BS 4N 100-3 |
Aircraft oxygen systems and equipment Part 3: Testing of equipment and systems-AMD 14906: March 1, 2004 |
|
BSI BS 4N 100-2 |
Aircraft oxygen systems and equipment Part 2: Tests for the compatibility of materials in the presence of oxygen-AMD 13414: February 4, 2002; AMD 15357: October 31, 2005 |
|
BSI BS IEC 60874-10-1 |
Connectors for Optical Fibres and Cables - Part 10-1: Detail Specification for Fibre Optic Adaptor Type BFOC/2,5 Terminated to Multimode Fibre Type A1 |
|
BSI BS EN 123300 |
Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Multilayer Printed Boards-AMD 9252: September 15, 1996; |
|
BSI BS 123000 |
System of Quality Assessment - Generic Specification - Printed Boards |
|
BSI BS CECC 90000 |
Generic Specification: Monolithic Integrated Circuits (AMD 7386) January 15, 1993-Amd 1; |
|
BSI BS 9075 N024 |
Detail Specification for Fixed Capacitors of Assessed Quality: Monolithic Ceramic Dielectric Type 2C1. Full Assessment-Amd 2; |
|
BSI BS 9720 |
Custom-Built Transformers and Inductors of Assessed Quality: Generic Data and Methods of Test-AMD 6348: September 30, 1991 |
|
BSI BS CECC 00009 |
Basic Testing Procedures and Measuring Methods for Electromechanical Components: Basic Specification |
|
BSI BS CECC 41300 |
Low Power Single-Turn Rotary Potentiometers: Sectional Specification |
|
BSI BS EN 60874-1 |
Connectors for Optical Fibres and Cables - Part 1: Generic Specification |
|
BSI BS EN 187105 |
Single Mode Optical Cable (Duct/Direct Buried Installation) |
|
BSI BS 9000 PART 3 |
General Requirements for a System for Electronic Components of Assessed Quality Part 3: Specification for the National Implementation of the IECQ System (T) |
|
BSI DD IEC/TS 62396-1 |
Process management for avionics Atmospheric radiation effects Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment |
|
BSI BS 123500 |
System of Quality Assessment - Sectional Specification - Flexible Single-Sided and Double-Sided Printed Boards with Through-Connections |
|
BSI BS 9131 N001-N016 |
Detail Specification for Lead-Screw Actuated Wirewound or Non-Wirewound Preset Potentiometers Rectangular and Square Forms, Container Sealed, Actuating Device Insulated from Resistive Element, Slipping Clutch at Each End of Travel Full Assessment Level-AMD 4679; April 30, 1985; |
|
BSI BS 9400 |
Integrated Electronic Circuits and Micro-Assemblies of Assessed Quality: (Qualification Approval Procedures): Generic Data and Methods of Test-AMD 7224 November 15, 1992; Replaced by BS CECC 90000:1985 but Remains Current Due to Existing Approvals; |
|
BSI BS EN ISO 9969 |
Thermoplastics Pipes - Determination of Ring Stiffness (T) |
|
BSI BS IEC 60874-14-1 |
Connectors for Optical Fibres and Cables - Part 14-1: Detail Specification for Fibre Optic Connector Type SC-PC Standard Terminated to Multimode Fibre Type A1a, A1b |
|
BSI BS 9125 |
Capability Approval of Manufacturers of Passive Radio Interference Suppression Filter Units of Assessed Quality Generic Data (AMD 7510) February 15, 1993-Amd 1; |
|
BSI BS 9300 C667-668 |
Detail Requirements for Silicon Avalanche Rectifier Diodes (Based on Military Specification CV7667-68) |
|
BSI BS 9521 |
Removable Contacts of Assessed Quality for Electrical Connectors as Defined by BS 9520: Generic Data, Methods of Test and Rules for the Preparation of Detail Specifications-Amd 1; |
|
BSI BS 9525 |
Rules for the Preparation of Detail Specifications for Two- Part Printed Board Electrical Connectors and Board-Mounted Transition Devices of Assessed Quality for d.c. and l.f. Applications. Full and Basic Assessment Levels (AMD 6609) September 30, 1991-Amd 1; |
|
BSI BS CECC 41200 |
Power Potentiometers: Sectional Specification |
|
BSI BS CECC 42200 |
Surge Suppression Varistors |
|
BSI BS EN 60122-1 |
Quartz crystal units of assessed quality Part 1: Generic specification-Supersedes BS EN 168000; |
|
BSI BS EN 61076-2-102 |
Connectors for Electronic Equipment Part 2-102: Circular Connectors with Assessed Quality Detail Specification for Plugs and Jacks for External Low Voltage Power Supply |
|
BSI BS 123300 |
System of Quality Assessment - Sectional Specification - Rigid Multilayer Printed Boards |
|
BSI BS 123300-003 |
System of Quality Assessment - Capability Detail Specification - Rigid Multilayer Printed Boards |
|
BSI BS 9075 N023 |
Detail specification for Fixed monolithic ceramic dielectric capacitors (type 1B) Rectangular non-metallic case, centred wires on one face Full assessment level-AMD 7413: January 1993; |
|
BSI BS EN 114000 |
Generic Specification: Photomultiplier Tubes (AMD 7575) February 15, 1993 (Formerly BS CECC 14000: 1981) (T)-Amd 1; |
|
BSI BS EN 12300 |
Cryogenic Vessels - Cleanliness for Cryogenic Service-AMD 16379: July 31, 2006 |
|
BSI BS EN 132100 |
Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Fixed Multilayer Cramic Surface Mounting Capacitors Assessment Levels EZ and DZ |
|
BSI BS 9734 |
Sectional Specification for Pulse Transformers of Assessed Quality for Use in Electronic Equipment: Full Assessment Level (T) |
|
BSI BS CECC 00806 |
Harmonized System of Quality Assessment for Electronic Components Guide to Total Quality Management (TQM) for CECC-Approved Organizations |
|
BSI BS EN 120001 |
Blank Detail Specification: Light Emitting Diodes, Light Emitting Diode Arrays, Light Emitting Diode Displays Without Internal Logic and Resistor (AMD 8000) October 15, 1993 (Formerly BS CECC 20001 : 1991. Replaces BS CECC 20001: 1983) (T)-Amd 1; |
|
BSI BS EN 60122-3 |
Quartz crystal units of assessed quality - Part 3: Standard outlines and lead connections-Supersedes BS 5069-1: 1980 |
|
BSI BS EN 60738-1-1 |
Thermistors - Directly Heated Positive Step-Function Temperature Coefficient - Part 1-1: Blank Detail Specification - Current Limiting Application - Assessment Level EZ-Supersedes BS EN 144001: 1995; IEC 60738-1-1: 1998; |
|
BSI BS QC 301900 |
Fixed Capacitors for Use in Electronic Equipment Sectional Specification for Fixed Multilayer Ceramic Chip Capacitors (IEC 384-10: 1989) (T) |
|
BSI BS 9073 N0034 |
Detail Specification for Fixed Capacitors, Tantalum Electrolytic, Porous Anode, Polar, Non-Solid Electrolyte, Tubular Metallic Case, Insulated, PTFE/ Elastomer Seal, Axial Wire Terminations. Full Plus Additional Assessment-Amd 1; |
|
BSI BS 9150 |
Electrical Relays of Assessed Quality: Generic Data and Methods of Test-Amd 1; |
|
BSI BS EN 100114-1 |
Rule of Procedure 14 Quality Assessment Procedures Part 1: CECC Requirements for the Approval of an Organization |
|
BSI BS EN 190103 |
Family Specification: Digital Integrated TTL Low Power SCHOTTKY Circuits Series 54LS, 64LS, 74LS, 84LS (AMD 8370) September 15, 1994 (Formerly BS CECC 90103: 1990 Replaces BS CECC: 90103: 1980 and BS CECC: 90103: 1983) (T)-Amd 3; |
|
BSI BS EN 196000 |
Generic Specification: Electromechanical Switches-AMD 13530: April 26, 2002; |
|
BSI BS EN 60738-1-2 |
Thermistors - Directly Heated Positive Step-Function Temperature Coefficient - Part 1-2: Blank Detail Specification - Heating Element Application - Assessment Level EZ-Supersedes BS EN 144002: 1995; IEC 60738-1-2: 1998; |
|
BSI BS EN 60738-1-3 |
Thermistors - Directly Heated Positive Step-Function Temperature Coefficient - Part 1-3: Blank Detail Specification - Inrush Current Application - Assessment Level EZ-Supersedes BS EN 144003: 1995; IEC 60738-1-3: 1998; |
|
BSI BS ISO/IEC 9805-1 |
Information Technology - Open Systems Interconnection - Protocol for the Commitment, Concurrency and Recovery Service Element - Part 1: Protocol Specification |
|
BSI BS QC 001002-2 |
Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) Part 2: Documentation, Including a New Clause on Regulations for Technology Approval Schedules |
|
BSI BS QC 001002-3 |
Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) Part 3. Approval Procedures, Including a New Clause on Technology Approval |
|
BSI BS QC 160000 PART 2 |
Electromechanical All-Or-Nothing Relays. Electrical Relays: Generic Specification Part 2: Quality Assessment Procedures |
|
BSI BS QC 960200 |
Electromechanical Switches for Use in Electronic Equipment Sectional Specification for Lever (Toggle) Switches (IEC 1020-4: 1991) |
|
BSI BS QC 960300 |
Electromechanical Switches for Use in Electronic Equipment Sectional Specification for Sensitive Switches (IEC 1020-6: 1991) |
|
BSI BS 123700 |
System of Quality Assessment - Sectional Specification - Flex-Rigid Double-Sided Printed Boards with Through-Connections |
|
BSI BS 9070 N003 |
Fixed Capacitors of Assessed Quality: Generic Data and Methods of Test N0003: Detail Specification for Fixed Mica Dielectric Capacitors of Assessed Quality: Style C2AEA. General Application Category-Amd 1; |
|
BSI BS 9300 C776-777 |
Detail Requirements for Germanium Coaxial Mixer Diodes (Based on Military Specification CV7776-77) |
|
BSI BS CECC 23300-003 |
Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Multilayer Printed Boards-AMD 9807; February, 1998; |
|
BSI BS CECC 30801 |
Blank Detail Specification: Tantalum Surface Mounting Capacitors |
|
BSI BS CECC 41202 |
Power Potentiometers (Assessment Level M): Blank Detail Specification |
|
BSI BS CECC 96000 |
Electromechanical Switches: Generic Specification |
|
BSI BS EN 123200 |
Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Single and Double Sided Printed Boards with Plated Through Holes-AMD 9251: September 15, 1996; |
|
BSI BS EN 60738-1-4 |
Thermistors - Directly Heated Positive Step-Function Temperature Coefficient - Part 1-4: Blank Detail Specification - Sensing Application - Assessment Level EZ-Supersedes BS EN 144004: 1995; IEC 60738-1-4: 1998; |
|
BSI BS IEC 60874-10-2 |
Connectors for Optical Fibres and Cables - Part 10-2: Detail Specification for Fibre Optic Connector Type BFOC/2,5 Terminated to Single-Mode Fibre Type B1 |
|
BSI BS ISO/IEC 9314-5 |
Information Technology Fibre Distributed Data Interface (FDDI) - Part 5: Hybrid Ring Control (HRC) (T) |
|
BSI BS 7039 |
Recommendations for Dimensions of Spindle Ends and Bushes, and for Dimensions for the Mounting of Single-Hole, Bush-Mounted Spindle-Operated Variable Capacitors, Variable Resistors and Potentiometers for Electronic Equipment |
|
BSI BS 9300 |
Semiconductor Devices of Assessed Quality: Generic Data and Methods of Test-AMD 7517: February 15, 1993; The BS 9300 Series Replaces BS 3494: Part 1: 1967 and BS 3494: Part 2: 1966. Replaced by BS CECC 50000: 1987 but Remains Current Due to Existing Approvals; |
|
BSI BS 9300 C379-388 |
Detail Requirements for Silicon Stud Mounted, Power Rectifier Diodes (Based on Military Specification CV7379-88) |
|
BSI BS 9490 |
Rules for the Preparation of Detail Specifications for Digital Integrated Circuits of Assessed Quality: Full Assessment Level-Amd 3; |
|
BSI BS 9564 |
Push-Button Switches of Assessed Quality: Generic Data and Methods of Test; General Rules for the Preparation of Detail Specification (AMD 4714) April 28, 1989-Amd 1; |
|
BSI BS CECC 00804 |
Harmonized System of Quality Assessment for Electronic Components Interpretation of 'EN ISO 9000: 1994' Reliability Aspects for Electronic Components (T) |
|
BSI BS CECC 30500 |
Fixed Metallized Polycarbonate Film Dielectric Capacitors for Direct Current-Superseded by BS EN 130500: 1998; Supersedes BS 9070: SEC 6: 1971 |
|
BSI BS CECC 31100 |
Sectional Specification: Fixed Ceramic Dielectric Capacitors of Barrier Layer Type (Dielectric Class 3) (AMD 7402) March 15, 1993-Amd 1; |
|
BSI BS CECC 41201 |
Power Potentiometers (Assessment Level S): Blank Detail Specification |
|
BSI BS CECC 42000 |
Varistors: Generic Specification (AMD 5590) April 30, 1990-Amd 2; |
|
BSI BS EN 12818 |
LPG equipment and accessories Inspection and requalification of LPG tanks up to and including 13 m3 underground-AMD 16181: July 31, 2006 |
|
BSI BS EN 140400 |
Harmonized system of quality assessment for electronic components Sectional specification: Fixed low power surface mount (SMD) resistors |
|
BSI BS EN 140401-801 |
Detail Specification: Fixed Low Power Non Wire-Wound Surface Mount (SMD) Resistors Rectangular Stability Classes 0,1; 0,25; 0,5; 1-AMD 14647: December 9, 2003; |
|
BSI BS EN 165000-1 |
Harmonized System of Quality Assessment for Electronic Components Film and Hybrid Integrated Circuits Part 1: Generic Specification Capability Approval Procedure (T) |
|
BSI BS IEC 60874-14-3 |
Connectors for Optical Fibres and Cables - Part 14-3: Detail Specification for Fibre Optic Adaptor (Simplex) Type SC for Single-Mode Fibre |
|
BSI BS IEC 60874-14-4 |
Connectors for Optical Fibres and Cables - Part 14-4: Detail Specification for Fibre Optic Adaptor (Simplex) Type SC for Multimode Fibre |
|
BSI BS ISO/IEC 9804 |
Information Technology - Open Systems Interconnection - Service Definition for the Commitment, Concurrency and Recovery Service Element |
|
BSI BS N 6 |
Specification for aeromedical portable oxygen concentrator systems General requirements |
|
BSI BS 9000 PART 5 |
General Requirements for Electronic Components of Assessed Quality Part 5: Qualification Approval and Conformance Testing Procedures |
|
BSI BS 9030 |
Magnetrons of Assessed Quality: Generic Data and Methods of Test-Amd 2; |
|
BSI BS 9130 |
Potentiometers of Assessed Quality: Generic Data and Methods of Test (T)-Amd 2; |
|
BSI BS 9210 N006 PT 2 |
Detail Specification for Radio Frequency Connectors (Series SMA), 50 ohms, Unsealed, Soldered, Centre Contact, Clamp Outer for Flexible Cables, Solder Outer for Semi-Rigid Cables: Part 2: Control Drawings, Mating Face Details and Gauge Information |
|
BSI BS 9210 N009 PT 1 |
Detail Specification for Components of Assessed Quality, Soldered Part 1: R.F. Connectors, (Series SMC), Unsealed, Soldered, Captive Contact, 50 Ohms (Screw Coupling) N0009: Full Assessment Level. Ratings, Ordering Information and Inspection Requirement-Amd 1; |
|
BSI BS 9525 N0001 |
Detail specification for multi-contact two-part printed board electrical connectors-AMD 6856: June 1992; |
|
BSI BS 9751 N0001 |
Detail specification for fixed insulated (unshielded) radio frequency inductors Wire wound on ferrite, iron dust or phenolic cylindrical former Full assessment level |
|
BSI BS CECC 30601 |
Fixed Ceramic Dielectric Capacitors. Class 1: Blank Detail Specification (AMD 4551) March 30, 1984-Amd 1; |
|
BSI BS EN 116000-3 |
Harmonized System of Quality Assessment for Electronic Components Generic Specification: Electromechanical All-or-Nothing Relays Part 3: Test and Measurement Procedures (T) |
|
BSI BS EN 60384-1 |
Fixed Capacitors for Use in Electronic Equipment Part 1: Generic Specification-Supersedes BS EN 130000:1994 |
|
BSI BS EN ISO 14851 |
Determination of the ultimate aerobic biodegradability of plastic materials in an aqueous medium Method by measuring the oxygen demand in a closed respirometer-AMD 15255:September 3, 2004; Renumbers BS ISO 14851:1999 |
|
BSI BS IEC 60874-10-3 |
Connectors for Optical Fibres and Cables - Part 10-3: Detail Specification for Fibre Optic Adaptor Type BFOC/2,5 for Single and Multimode Fibre |
|
BSI BS IEC 60874-14-5 |
Connectors for Optical Fibres and Cables - Part 14-5: Detail Specification for Fibre Optic Connector Type SC-PC Untuned Terminated to Single-Mode Fibre Type B1 |
|
BSI BS QC 001002 |
Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) (AMD 7711) June 15, 1993 (T)-Amd 1; |
|
BSI BS QC 160000 PART 1 |
Electromechanical All-Or-Nothing Relays. Electrical Relays: Generic Specification Part 1: Test and Measurement Procedures |
|
BSI BS QC 160100 |
Electromechanical All-Or-Nothing Relays. Electrical Relays: Sectional Specification |
|
BSI BS QC 160101 |
Electromechanical All-Or-Nothing Relays Test Schedules 1, 2, and 3: Blank Detail Specification |
|
BSI BS QC 750005 |
Voltage-Regulator Diodes and Voltage-Reference Diodes, Excluding Temperature Compensated Precision Reference Diodes |
|
BSI BS QC 750113 |
Blank Detail Specification Reverse Blocking Triode Thyristors, Ambient and Case-Rated, for Currents Greater Than 100A (In Accordance with BS QC 750100) (T) |
|
BSI BS 9040 |
Gas-Filled Microwave Switching Tubes of Assessed Quality: Generic Data and Methods of Test |
|
BSI BS 9074 N002 |
Detail Specification for Fixed Polystyrene Foil Dielectric Capacitors Tubular Insulated Case, Axial Terminations Full Assessment Level (AMD 7411) January 15, 1993-Amd 5; |
|
BSI BS 9074 N007 |
Polystyrene film dielectric capacitors, extended foil Rectangular non-metallic case, unidirectional terminations Full plus additional assessment level-AMD 3862: December 1981; Supersedes BS 9074 N007: 1978, which remains current due to existing approvals; |
|
BSI BS 9090 |
Variable Capacitors of Assessed Quality: Generic Data and Methods of Test-Amd 2; |
|
BSI BS 9100 |
Capability Approval for Custom-Built Capacitors and Capacitor Modules: Generic Data and Methods of Test-AMD 7508: October 15, 1993; |
|
BSI BS 9133 |
Rules for the Preparation of Detail Specifications for Single Turn Low Power Rotary Potentiometers of Assessed Quality |
|
BSI BS 9151 |
Rules for the Preparation of Detail Specifications for All-Or-Nothing Electromechanical Relays of Assessed Quality-Amd 2; |
|
BSI BS 9300 C476 |
Detail Requirements for Silicon Avalanche Rectifier Diode (Based on Military Specification CV7476) |
|
BSI BS 9305 N041 |
Detail Specification for Voltage Regulator Diodes of Assessed Quality. General Application Category Q. 440 mW, 2.7 to 33 V (5 Per Cent) (Direct Replacements for the CV7009-CV7106 and CV7138-CV7146) |
|
BSI BS 9305 N044 |
Detail specification for silicon voltage regulator diodes 1.0 W, 3.3 to 33 V (5%), hermetically scaled Full assessment level |
|
BSI BS CECC 00013 |
Scanning Electron Microscope Inspection of Semiconductor Dice. Basic Specification |
|
BSI BS CECC 00017 |
Basic Specification: Microwave Common Modules for Use up to 20 GHz. Interfaces, Fixings, Connection Protocol and Module Coding (T) |
|
BSI BS CECC 16100 |
Electromechanical All-Or-Nothing Relays: Sectional Specification |
|
BSI BS CECC 22000 |
Generic Specification: Radio Frequency Coaxial Connectors (Parts I, II and III) (T) |
|
BSI BS CECC 22110 |
Radio Frequency Coaxial Connectors, Series SMA: Sectional Specification |
|
BSI BS CECC 41400 |
Rotary Precision Potentiometers: Sectional Specification-Amd 1:December 30,1983 |
|
BSI BS CECC 90202 |
Blank Detail Specification: Integrated Operational Amplifiers-AMD 8293 August 15, 1994; Replaces BS CECC 90202: 1985; |
|
BSI BS CECC 96400 |
Sectional Specification Including Blank Detail Specification: Push- Button Switches |
|
BSI BS EN 116203 |
Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification: Electromechanical All-or-Nothing Relays for Enhanced Industrial Application |
|
BSI BS EN 116205 THRU 116207 |
Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification: Hermetically Sealed Relays - for Severe Static Environmental Conditions (116205) for Severe Mobile Environmental Conditions (116206) for Severe Airborne Environmental Conditions (116207) |
|
BSI BS EN 116300 |
Sectional Specification: Electromechanical All-or-Nothing Heavy Load Relays of Assessed Quality (Rated from 5 A and Above) (T) |
|
BSI BS EN 123500 |
Harmonized System of Quality Assessment for Electronic Components: Sectional Specification: Flexible Printed Boards with Through Connections-AMD 9574: December 1997; Read in Conjunction with BS EN 123000; |
|
BSI BS EN 130500 |
Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Fixed Metallized Polycarbonate Film Dielectric Capacitors for Direct Current-Supersedes BS CECC 30500: 1989; |
|
BSI BS EN 13166 |
Thermal insulation products for buildings Factory made products of phenolic foam (PF) Specification-AMD 15257: July 15, 2004; CORR 16202: April 28, 2006; CORR 16543: July 31, 2006 |
|
BSI BS EN 137100 |
Harmonized System of Quality Assessment for Electronic Components Sectional Spec.: Fixed Aluminium Electrolytic a.c. Capacitors with Non-Solid Electrolyte for Motor Starter Applications - Qualification Approval (T) |
|
BSI BS EN 150001 |
Blank Detail Specification: General Purpose Semiconductor Diodes (AMD 7590) February 1993 (Formerly BS CECC 50001: 1981 Replaces BS E9371: 1975) (T)-Amd 1; |
|
BSI BS EN 150014 |
Harmonized system of quality assessment for electronic components Blank detail specification: Thyristor diodes, transient overvoltage suppressors-AMD 9310: January 15, 1997; Renumbers BS CECC 50014: 1995; |
|
BSI BS EN 3155-061 |
Aerospace series Electrical contacts used in elements of connection Part 061: Contacts, electrical, coaxial, size 12, female, type D, solder, class R Product standard |
|
BSI BS EN 4199-006 |
Aerospace series Bonding straps for aircraft Part 006: Round braid copper conductors for bonding straps, tin plated up to 150 degrees C or nickel plated up to 260 degrees C Product standard |
|
BSI BS EN 60938-2 |
Fixed Inductors for Electromagnetic Interference Suppression - Part 2: Sectional Specification-AMD 17010: May 31, 2007 |
|
BSI BS EN 61811-50 |
Electromechanical All-or-Nothing Relays Part 50: Sectional Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality-Supersedes BS EN 116500: 1996; |
|
BSI BS EN 61811-51 |
Electromechanical All-or-Nothing Relays Part 51: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Non-Standardized Types and Construction-Supersedes BS EN 116501: 1996; |
|
BSI BS QC 200012 |
Process Assessment Schedule for Printed Board Design Facilities |
|
BSI BS QC 400102 |
Fixed Low-Power Non-Wirewound Resistors Assessment Level F (IEC 115-2-2: 1992) |
|
BSI BS QC 790132 |
Bipolar Monolithic Digital Integrated Circuit Gates (Excluding Uncommitted Logic Arrays) (T) |
|
BSI BS QC 960000 |
Electromechanical Switches for Use in Electronic Equipment Generic Specification (IEC 1020-1: 1991) |
|
BSI BS QC 960501 |
Electromechanical Switches for Use in Electronic Equipment Blank Detail Specification for in-Line Package Switches (IEC 1020-3-1: 1991) |
|
BSI PD 6460 |
Collected Amendments to the CV 7000 Specifications for Semiconductors Adopted as British Standards (9300 Series)-Amd 2; |
|
BSI BS 9000 PART 4 |
General Requirements for a System for Electronic Components of Assessed Quality Part 4: Specification of Procedures for the Approval of an Organization |
|
BSI BS 9000 PART 7 |
General Requirements for Electronic Components of Assessed Quality Part 7: Lot Formation, Release Procedures and Certified Test Records |
|
BSI BS 9031 |
Rules for the Preparation of Detail Specifications for Pulsed Fixed-Frequency Magnetrons of Assessed Quality-AMD 1131: March 1973; AMD 1727: April 1975 |
|
BSI BS 9070 SEC 5 |
Fixed Capacitors of Assessed Quality: Generic Data and Methods of Test Section 5: Ceramic Dielectric Capacitors-AMD 7396; March 15, 1993; Superseded by BS CECC 306 & BS CECC 30700; |
|
BSI BS 9070 SEC 6 |
Fixed Capacitors of Assessed Quality: Generic Data and Methods of Test Section 6: Polycarbonate Dielectric Capacitors and Polyethylene Terephthalate Dielectric Capacitors for d.c. Use and Polypropylene Dielectric Capacitors for d.c. and a.c. Use-AMD 7397; March 15, 1993; Superseded by BS CECC 30100, 30400, 30500, 31200, 31700, 31800; |
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BSI BS 9076 N001-004 |
Detail Specification for Fixed Metallized Polyethylene-Metallized Polycarbonate Film Dielectric Capacitors. Rectangular Non-Metallic Case, Axial or Radial Terminations, Centrally Spaced. Full Assessment-Amd 4; |
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BSI BS 9210 N006 PT 1 |
Detail Specification for Radio Frequency Connectors of (Series SMA), 50 Ohms, Unsealed, Soldered, Centre Contact, Clamp Outer for Flexible Cables, Solder Outer for Semi-Rigid Cables Part 1: Full Assessment Level Physical Characteristics and Ratings, Together with Inspection Requirements. Climatic Category |
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BSI BS 9300 C534 |
Detail Requirements for a Silicon Coaxial Resistive Switching Diode (Based on Military Specification CV7534) |
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BSI BS 9364 N011 |
Detail Specification for Low Power P-N-P, 65 V, 500 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation-Amd 1; |
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BSI BS 9617 |
Quartz Crystal Units of Assessed Quality: Full Assessment Level-Supersedes BS 9611: 1973, BS 9612: 1973 and BS 9005 |
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BSI BS 9940 PART 05.00 |
Fixed Resistors for Use in Electronic Equipment Part 05.00: Fixed Resistor Networks in Which Not All Resistors Are Individually Measurable: Sectional Specification |
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BSI BS CECC 16101 |
Electromechanical All-Or-Nothing Relays: Blank Detail Specification: Test Schedule 3 |
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BSI BS CECC 41000 |
Harmonized system of quality assessment for electronic components: Generic specification for potentiometers-AMD 4100: November 1982 |
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BSI BS CECC 50000 |
Harmonized system of quality assessment for electronic components Generic specification: Discrete semiconductor devices-AMD 7012: October 1992; |
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BSI BS EN 100114-6 |
CECC Quality Assessment Procedure for Electronic Components - Part 6: Technology Approval of Manufacturers-AMD 10507; March 2000; Supersedes BS CECC 00114-6: 1994; |
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BSI BS EN 116204 |
Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification: Electromechanical All-or- Nothing Sealed Relays for Aggressive Industrial Application |
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BSI BS EN 122110 |
Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Radio Frequency Coaxial Connectors Series SMA (T) |
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BSI BS EN 123400-800 |
Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards without Through-Connections (AMD 7368) November 15, 1992 (T)-Amd 1; |
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BSI BS EN 137000 |
Harmonized System of Quality Assessment for Electronic Components Generic Specification: Fixed Aluminium Electrolytic A.C. Capacitors with Non-Solid Electrolyte for Use with Motors |
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BSI BS EN 137101 |
Harmonized System of Quality Assessment for Electronic Components Blank Detail Spec. Fixed AluminiumElectrolytic a.c. Capacitors with Non-Solid Electrolyte for Motor Starter Applications (Qualification Approval) (T) |
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BSI BS EN 150008 |
Blank Detail Specification Ambient-Rated Rectifier Diodes-AMD 7698; June 15, 1993; Formerly BS CECC 50008: 1991; Replaces BS CECC 50008: 1982 |
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BSI BS EN 160100 |
Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Capability Approval of Manufacturers of Printed Board Assemblies of Assessed Quality |
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BSI BS EN 175101-809 |
Harmonized system of quality assessment for electronic components Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality |
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BSI BS EN 186290 |
Harmonized System of Quality Assessment for Electronic Components Connector Sets for Optical Fibres and Cables - Type MPO |
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BSI BS EN 190000 |
Harmonized System of Quality Assessment for Electronic Components Generic Specification: Monolithic Integrated Circuits (T) |
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BSI BS EN 196500 |
Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Membrane Switches Including Blank Detail Specification EN 196501-AMD 13458: January 15, 2002; |
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BSI BS EN 3708-001 |
Aerospace series Modular interconnection systems Terminal junction systems Part 001: Technical specification |
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BSI BS EN 4592 |
Aerospace series Paints and varnishes Test method for determination of infrared reflectance |
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BSI BS EN 60368-4 |
Piezoelectric Filters of Assessed Quality - Part 4: Sectional Specification - Capability Approval-IEC 60368-4:2000; Supersedes BS EN 167100:1996; |
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BSI BS EN 61811-52 |
Electromechanical All-or-Nothing Relays Part 52: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Two Change-Over Contacts, 20 mm x 10 mm Base-Supersedes BS EN 116502: 1995; |
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BSI BS QC 222000 |
Radio-Frequency Connectors RF Coaxial Connectors with Inner Diameter of Outer Conductor 6,5 mm (0,256 in) with Screw Coupling - Characteristic Impedance 50 ohms (Type TNC) |
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BSI BS QC 420000 |
Varistors for Use in Electronic Equipment: Generic Specification (IEC 1051-1: 1992) (AMD 7528) January 15, 1993-Amd 1; |
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BSI BS QC 420100 |
Varistors for Use in Electronic Equipment: Sectional Specification for Surge Suppression Varistors (IEC 1051-2: 1992) |
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BSI BS QC 750109 |
Blank Detail Specification: Rectifier Diodes (Including Avalanche Rectfier Diodes), Ambient and Case-Rated, for Currents Greater Than 100 A (IEC 747-2-2: 1993) (In Accordance with BS QC 750100) (T) |
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BSI BS QC 790109 |
Family Specification: HCMOS Digital Integrated Circuits, Series 54/74 IIC, 54/74 HCT, 54/74 HCU (AMD 8377) September 15, 1994 (T)-Amd 1; |
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BSI BS QC 960101 |
Harmonized system of quality assessment for electronic components Blank detail specification Electromechanical switches for use in electronic equipment Blank detail specification for rotary switches-IEC 1020-2-1: 1991; |
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BSI BS QC 960500 |
Electromechanical Switches for Use in Electronic Equipment Sectional Specification for in-Line Package Switches (IEC 1020-3: 1991) |
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BSI BS 9000 PART 6 |
(OBSOLESCENT)1989 General Requirements for Electronic Components of Assessed Quality Part 6: Capability Approval Procedures |
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BSI BS 9070 SEC 1 & 2 |
Fixed Capacitors of Assessed Quality: Generic Data and Methods of Test Section 1: Principles and Mandatory Procedures Section 2: General Rules for Drafting Detail Specifications-AMD 7393; March 15, 1993; Superseded by BS CECC 30000; |
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BSI BS 9120 |
Radio Interference Suppression Filters of Assessed Quality: Generic Data and Methods of Test (AMD 7509) February 15, 1993 (T)-Amd 1; |
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BSI BS 9133 N001-003 |
Detail Specification for Non-Wirewound Single Turn Low Power Rotary Potentiometers of Assessed Quality Full Assessment-AMD 2087: September 30, 1976; |
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BSI BS 9210 N006 PT 3 |
Detail Specification for Radio Frequency Connectors of Assessed Quality Part 3: Full Assessment Level. Detail Specification, Parameters |
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BSI BS 9220 N001 |
Detail Specification for Rigid Waveguide Tubing, Ordinary Rectangular (2:1) of Assessed Quality General Application Category |
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BSI BS 9305 N001 |
Detail specification for silicon voltage regulator diodes 1.5 W, 3.3 to 33 V (5%), hermetically sealed General application category Q |
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BSI BS 9364 N013 |
Detail Specification for Low Power P-N-P, 25 V, 300 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation.-Amd 1; |
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BSI BS 9493 |
Rules for the Preparation of Detail Specifications for Integrated Circuits of Assessed Quality Which Perform Mixed Digital and/or Analogue Functions |
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BSI BS 9563 |
Rotary (Manual) Switches of Assessed Quality: Generic Data and Methods of Test: General Rules for the Preparation of Detail Specifications |
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BSI BS 9925 PT 02.01&02.02 |
Inductor and Transformer Cores for Telecommunications Part 02.01 and Part 02.02: Magnetic Oxide Cores for Broad Band Transformers Assessment Levels A and B: Blank Detail Specification |
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BSI BS CECC 20000 |
Semiconductor Optoelectronic and Liquid Crystal Devices: Generic Specification-Amd 1; |
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BSI BS CECC 299 001 |
Technology Approval Schedule - Manufacture of Electrical Connectors-CECC 299 001:1999; |
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BSI BS CECC 41101 |
Preset potentiometers (Assessment Level S): Blank Detail Specification |
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BSI BS CECC 41102 |
Preset Potentiometers: Blank Detail Specification: Assessment Level M |
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BSI BS CECC 63000 |
Film and Hybrid Integrated Circuits: Generic Specification |
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BSI BS E9063 |
Specification for Harmonized system of quality assessment for electronic components: Blank Detail Specification: Industrial Heating Triodes |
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BSI BS E9065 |
Specification for Harmonized system of quality assessment for electronic components: Blank detail specification: Small power transmitting tubes of anode dissipation up to 1 kW-CECC 45003:1975 |
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BSI BS EN 100012 |
Basic Specification: X-Ray Inspection of Electronic Components (T) |
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BSI BS EN 116200 |
Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Electromechanical All-or-Nothing Relays (Including Relays for Severe Environmental Conditions)-AMD 9627: October 1997; Renumbers BS CECC 16200:1992 |
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BSI BS EN 119000 |
Harmonized System of Quality Assessment for Electronic Components Generic Specification Dry and Mercury Wetted Reed Contact Units |
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BSI BS EN 123400 |
Harmonized System of Quality Assessment for Electronic Components Sectional Specification: Flexible Printed Boards without Through Connections-AMD 9253: September 15, 1996; |
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BSI BS EN 123500-800 |
Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards with Through-Connections (AMD 7370) November 15, 1992 (T)-Amd 1; |
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BSI BS EN 141101 |
Blank Detail Specification Lead-Screw Actuated and Rotary Preset Potentiometers-Replaces BS CECC 41101: 1978 |
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BSI BS EN 190100 |
Harmonized System of Quality Assessment for Electronic Components: Sectional Specification: Digital Monolithic Integrated Circuits (AMD 7845) July 15, 1993 (Formerly BS CECC 90100: 1986 Replaces BS CECC 90100: 1983) (T)-Amd 3; |
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BSI BS EN 297 |
Gas-fired central heating boilers Type B11 and B11BS boilers fitted with atmospheric burners of nominal heat input not exceeding 70 kW-AMD 8769: August 1995; AMD 9279: April 1997; AMD 10175: January 1999; AMD 14749: November 26, 2003; AMD 15849: December 8, 2005; CORR 16505: July 31, 2006; Partially supersedes BS 5258-1:1986 and BS 6332-1:1988 |
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BSI BS EN 3155-017 |
Electrical contacts used in elements of connection - Part 017: Contacts, electrical, relay base, female, type A, crimp, class P Product standard |
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BSI BS EN 4508 |
Paints and varnishes Test method for anti slip coatings Determination of the sliding friction behaviour |
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BSI BS EN 60368-2-2 |
Piezoelectric Filters - Part 2: Guide to the Use of Piezoelectric Filters - Section 2: Piezoelectric Ceramic Filters-IEC 60368-2-2: 1996; |
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BSI BS EN 60368-3 |
Piezoelectric Filters of Assessed Quality - Part 3: Standard Outlines and Lead Connections-IEC 60368-3: 2001; Supersedes BS 5069-2: 1983; |
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BSI BS EN 60368-4-1 |
Piezoelectric Filters of Assessed Quality - Part 4-1: Blank Detail Specification - Capability Approval-IEC 60368-4-1: 2000; Supersedes BS EN 167101: 1996; |
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BSI BS EN 60384-20 |
Fixed Capacitors for Use in Electronic Equipment - Part 20: Sectional Specification: Fixed Metallized Polyphenylene Sulfide Film Dielectric Surface Mount d.c. Capacitors-IEC 60384-20: 1996; |
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BSI BS EN 61076-2-101 |
Connectors for electronic equipment Part 2-101: Circular connectors Detail specification for circular connectors M8 with screw- or snap-locking, M12 with screw-locking for low voltage applications |
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BSI BS EN 61076-3-112 |
Connectors for electronic equipment Part 3-112: Rectangular connectors Detail specification for rectangular connectors with four contacts for high performance serial bus for consumer audio/video equipment |
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BSI BS QC 400600 |
Harmonized System of Quality Assessment for Electronic Components - Fixed Resistors for Use in Electronic Equipment: Sectional Specification: Fixed Surface Mounting (Chip) Resistors-AMD 13109:June 2001; IEC 60115-8:1989; |
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BSI BS 9210 |
Radio Frequency Connectors of Assessed Quality: Generic Data and Methods of Test-AMD 7654; July 15, 1993; Replaced by BS CECC 22000: 1980 but Remains Current Due to Existing Approvals; |
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BSI BS 9210 N001 PT 1 |
Radio Frequency Connector (Type BNC), Sealed, Soldered, Captive Content, 50 ohms Part 1: Detail Specification. Full Assessment Level |
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BSI BS 9300 C199-276 |
Detail Requirements for Silicon Voltage-Regulator Diodes |
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BSI BS 9300 C582-584 |
Electronic parts of assessed quality Reverse blocking triode thyristors-Issue 1; |
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BSI BS 9364 N007 & N009 |
Detail Specification for Low Power N-P-N, 20 V, 300 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation (CV 8615 and CV 8616)-Amd 1; |
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BSI BS 9364 N016 |
Detail Specification for Low Power N-P-N, 65 V, 600 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation.-Amd 1; |
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BSI BS 9940-01.0 |
Harmonized system of quality assessment for electronic components Fixed resistors for use in electronic equipment Part 01.0: Sectional specification: Fixed low power non-wirewound resistors-IEC 115-2: 1982; QC 400100: 1982; |
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BSI BS CECC 00800 |
Code of Practice for the Use of the ppm Approach in Association with the CECC System (T) |
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BSI BS CECC 200025 |
Harmonized System of Quality Assessment for Electronic Components; Process Assessment Schedule: Printed Board Assembly Facilities |
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BSI BS CECC 30300 |
Sectional Specification: Aluminium Electrolytic Capacitors with Solid and Non-Solid Electrolyte-Superseded by BS EN 130300: 1998 |
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BSI BS CECC 30700 |
Sectional Specification: Fixed Capacitors of Ceramic Dielectric, Class 2-AMD 7401; February 15, 1993; Supersedes BS 9070: SEC 5: 1971 |
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BSI BS CECC 30701 |
Blank Detail Specification: Fixed Capacitors of Ceramic Dielectric, Class 2 (Assessment Level E) |
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BSI BS CECC 40300 |
Fixed Precision Resistors: Sectional Specification |
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BSI BS CECC 41100 |
Lead Screw Actuated and Rotary Preset Potentiometers: Sectional Specification-Amd 1:December 23,1987 |
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BSI BS EN 116000-2 |
Generic Specification: Electromechanical All-or-Nothing Relays Part 2: Generic Data and Methods of Test for Time Delay Relays-AMD 8070: February 15, 1994; Renumbers BS CECC 16000-2:1986 |
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BSI BS EN 150012 |
Blank Detail Specification: Single Gate Field-Effect Transistors (AMD 7593) February 1993 (Formerly BS CECC 50012: 1978) (T)-Amd 2; |
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BSI BS EN 190101 |
Family Specification: Digital Integrated TTL Circuits Series 54, 64, 74, 84, (AMD 8378) September 15, 1994 (Formerly BS CECC 90101: 1990 Replaces BS CECC: 90101: 1980) (T)-Amd 2; |
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BSI BS EN 3668 |
Aerospace series - Heat resisting alloy NI-PH2301 (NiCr21Fe18Mo9) - Non heat treated - Forging stock - a or D < or = to 250 mm |
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BSI BS EN 3716-002 |
Aerospace series Connectors, single-way with triaxial interface, for transmission of digital data Part 002: Conditions of use and list of product standards |
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BSI BS EN 60384-20-1 |
Fixed Capacitors for Use in Electronic Equipment - Part 20: Blank Detail Specification: Fixed Metallized Polyphenylene Sulfide Film Dielectric Surface Mount d.c. Capacitors - Assessment Level EZ-IEC 60384-20-1: 1996; |
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BSI BS EN 60603-2 |
Harmonized system of quality assessment for electronic components - Connectors for Frequencies Below 3 MHz for Use with Printed Boards - Part 2: Detail Specification for Two-Part Connectors with Assessed Quality, for Printed Boards, for Basic Grid of 2,54 mm (0,1 in) with Common Mounting Features-AMD 15818: March 2006 |
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BSI BS EN 60938-2-1 |
Fixed Inductors for Electromagnetic Interference Suppression - Part 2-1: Blank Detail Specification - Inductors for Which Safety Tests Are Required - Assessment Level D-Supersedes BS EN 138101: 1997; IEC 60938-2-1: 1999; |
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BSI BS EN 60938-2-2 |
Fixed Inductors for Electromagnetic Interference Suppression - Part 2-2: Blank Detail Specification - Inductors for Which Safety Tests Are Required (Only)-IEC 60938-2-2: 1999; |
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BSI BS EN 61076-2 |
Connectors for Use in d.c. Low-Frequency Analogue and Digital High-Speed Data Applications - Part 2: Circular Connectors with Assessed Quality - Sectional Specification-IEC 61076-2: 1998; |
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BSI BS EN 61811-53 |
Electromechanical All-or-Nothing Relays Part 53: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Two Change-Over Contacts, 14 mm x 9 mm Base-Supersedes BS EN 116503: 1996; |
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BSI BS EN 61811-54 |
Electromechanical all-or-nothing relays Part 54: Blank detail specification Electromechanical all-or-nothing telecom relays of assessed quality Two change-over contacts, 15 mm x 7,5 mm base-Supersedes BS EN 116504:1996 |
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BSI BS ISO 22072 |
Electrohydrostatic actuator (EHA) Characteristics to be defined in procurement specifications |
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BSI BS ISO 8913 |
Aerospace - Lightweight polytetrafluoroethylene (PTFE) hose assemblies, classification 400°F/3 000 psi (204°C/20 684 kPa) and 204°C/21 000 kPa (400°F/3 046 psi) - Procurement specification |
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BSI BS QC 410100 |
Potentiometers for Use in Electronic Equipment Sectional Specification: Lead Screw Actuated and Rotary Preset Potentiometers |
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BSI BS QC 960201 |
Blank Detail Specification Electromechanical Switches for Use in Electronic Equipment Blank Detail Specification for Lever (Toggle) Switches-IEC 1020-4-1: 1991 |
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BSI BS 123100-003 |
System of Quality Assessment - Capability Detail Specification - Rigid Single-Sided and Double-Sided Printed Boards with Plain Holes |
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BSI BS 123500-003 |
System of Quality Assessment - Capability Detail Specification - Flexible Single-Sided and Double-Sided Printed Boards with Through-Connections |
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BSI BS 123800 |
System of Quality Assessment - Sectional Specification - Flexible Multilayer Printed Boards with Through-Connections |
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BSI BS 9032 |
Rules for the Preparation of Detail Specifications for Pulsed Magnetrons (Excluding Frequency- Agile Magnetrons) of Assessed Quality. Basic Assessment Level |
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BSI BS 9050 |
Cathode Ray Tubes of Assessed Quality. Generic Data and Methods of Test-AMD 1137: April 1973; AMD 1628: February 1975; AMD 2266: September 1977 |
|
BSI BS 9153 |
All-Or-Nothing Electromechanical Relays of Assessed Quality Primarily Intended for Telecommunication Applications: Full and Basic Assessment Levels-Amd 1; |
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BSI BS 9220 N002 |
Detail Specification for Medium Flat Rectangular Waveguide (4:1) of Assessed Quality. General Application Category |
|
BSI BS 9300 C771-772 |
Detail Requirements for Coaxial Mixer Diodes (Based on Military Specification CV7771-2) |
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BSI BS 9300 C780-831 |
Detail Requirements for Silicon Voltage Regulator Diodes (Based on Military Specification CV7780- 7831) |
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BSI BS 9300 C841-849 |
Detail Requirements for Silicon Voltage Regulator Diodes (Based on Military Specification CV7841- 7849) |
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BSI BS 9364 N008 & N010 |
Detail Specification for Low Power N-P-N, 20 V, 300 mW Switching Transistor of Assessed Quality, Ambient Rated, Hermetic Encapsulation |
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BSI BS 9526 N0002 |
Detail Specification for Multi-Contact Edge Socket Electrical Connectors, Single or Double Sided, Open Ended with Metal Fixing Flanges, Guide Key Location, Replaceable Contacts and Through-Board Solder or Wire-Warp Terminations |
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BSI BS 9561 |
Lever Operated Switches of Assessed Quality: Generic Data and Methods of Test: General Rules for the Preparation of Detail Specifications (AMD 4711) April 28, 1989-Amd 1; |
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BSI BS 9612 N005 |
Detail Specification for Cold-Welded Quartz Crystal Units of Assessed Quality for Oscillator Applications. Frequency Ranges 0.8 to 20 MHz, and 3 to 30 MHz, Narrow Temperature Range |
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BSI BS 9612 N006 |
Detail Specification for Cold-Welded Quartz Crystal Units of Assessed Quality for Oscillator Applications. Frequency Range 17 to 75 MHz, Wide Temperature Range |
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BSI BS 9741 |
Sectional Specification for Inductors of Assessed Quality for Use in Electronic Equipment for Capability Approval |
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BSI BS 9750 |
Fixed Radio Frequency Inductors of Assessed Quality: Generic Data and Methods of Test |
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BSI BS 9925 PART 0 |
Inductor and Transformer Cores for Telecommunications Part 0: Generic Specification |
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BSI BS 9925 PART 03.0 |
Inductor and Transformer Cores for Telecommunications Part 03.0: Magnetic Oxide Cores for Transformers and Chokes for Power Applications |
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BSI BS 9940 PART 04.0 |
Fixed Resistors for Use in Electronic Equipment Part 04.0: Fixed Resistor Networks with Individually Measurable Resistors: Sectional Specification (AMD 5916) September 29, 1989-Amd 1; |
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BSI BS 9940 PART 04.02 |
Fixed Resistors for Use in Electronic Equipment Part 04.2: Fixed Resistor Networks with Individually Measurable Resistors of Either Different Resistance Values or Different Rated Dissipators: Blank Detail Spec. Assessment Level E |
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BSI BS CECC 00016 |
Basic Specification: Basic Requirements for the Use of Statistical Process Control (SPC) in the CECC System (T) |
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BSI BS CECC 00109 |
Rule of Procedure 9 Certified Test Records |
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BSI BS CECC 00111 PT 2 |
Rule of Procedure 11 Specifications Part 2: Regulations for CECC Specifications for Components of Enhanced Assessment of Quality |
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BSI BS CECC 00111 PT 4 |
Rule of Procedure 11 Specifications Part 4: Regulations for CECC Detail Specifications (AMD 7734) May 15, 1993 (T)-Amd 2; |
|
BSI BS CECC 00111 PT 8 |
Rule of Procedure 11 Specifications Part 8: Regulations for Technology Approval Schedules (TAS) (T) |
|
BSI BS CECC 00112 PT 2 |
Rule of Procedure 12 Voting Procedures Part 2: CECC European Standards (T) |
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BSI BS CECC 00114 PT 3 |
Rule of Procedure 14 Quality Assessment Procedures Part 3: Capability Approval of an Electronic Component Manufacturing Activity (AMD 8473) March 15, 1995 (T)-Amd 2; |
|
BSI BS CECC 00802 |
Guidance Document: CECC Standard Method for the Specification of Surface Mounting Components (SMDs) of Assessed Quality (T) |
|
BSI BS CECC 00808 |
Harmonized System of Quality Assessment for Electronic Components Guidance Document: Use and Application of Plastic Encapsulated Devices (T) |
|
BSI BS CECC 123400-003 |
Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards Without Through-Connections-AMD 9198 December 15,1996; |
|
BSI BS CECC 16000 PT 1 |
Generic Specification: Electromechanical All-or-Nothing Relays Part 1: General-Supersedes BS CECC 16000:1980 |
|
BSI BS CECC 23100-003 |
Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double Sided Printed Boards with Plain Holes-AMD 9805; February, 1998; |
|
BSI BS CECC 23300-801 |
Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Multi-Layer Printed Boards-Supersedes BS EN 123300-800: 1992; |
|
BSI BS CECC 25300 |
Magnetic Oxide Cores for Power Applications: Sectional Specification-Amd 1:September 30,1982 |
|
BSI BS CECC 30401 |
Fixed Metallized Polyethylene Terephthalate Film Dielectric d.c. Capacitors: Blank Detail Specification |
|
BSI BS CECC 30600 |
Harmonized system of quality assessment for electronic components: Sectional specification: Fixed ceramic capacitors, Type 1-AMD 5983: July 1992; |
|
BSI BS CECC 30702 |
Blank Detail Specification: Fixed Capacitors of Ceramic Dielectric, Class 2 (Assessment Level P. Telecom Level) |