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BSI BS 5909: Scale Adhesion Test for Oxygen-Free Copper

Publication Date: Jan 1, 1980
SDO: BSI: British Standards Institution
 DOD Adopted   ANSI Approved Approved

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.

Copper
Electric conductors
Scale (corrosion)
Adhesion tests
Test specimens
Diameter
Area
Specimen preparation
Visual inspection (testing)
Surface defects

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