BSI BS 5909: Scale Adhesion Test for Oxygen-Free Copper
SDO: BSI: British Standards Institution
DOD Adopted ANSI Approved Approved
Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.
- Electric conductors
- Scale (corrosion)
- Adhesion tests
- Test specimens
- Specimen preparation
- Visual inspection (testing)
- Surface defects
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