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ASTM F 1512 Document Information:
Title
Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
ASTM International
Publication Date:
Apr 15, 1994
Scope:
This practice describes a method for ultrasonic mapping of the
soundness of a bond joining a
sputtering target to its supporting backing plate. The results of the
examination may be used in
predicting the target-backing plate assembly's suitability for use.
Accept/reject standards are not
specified; these are subject to agreement between target supplier and
user, depending upon the
application requirements.
This standard is intended to be used with Practice E 1001.
The method reveals unbonded areas 0.125 in. (3 mm) in diameter and
larger. The technique permits,
for example, unambiguous quantitative measurement of the voided area
in solder bonds.
This technique may also show regions in which bond integrity is
marginally degraded by imperfect
adhesion, for example, areas in which oxide inclusion has inhibited
the development of full bond
strength. Evaluation of indications of degraded bond areas may vary in
rigor from purely subjective
to semiquantitative. Target supplier and user must agree upon the
means used to display and grade
partially bonded areas.
This practice is applicable to assemblies having planar bonds in which
the design provides at least
one flat plane parallel to the bond that may be used as the entry/exit
surface for ultrasonic
excitation.
Only the immersion pulse-echo method is covered.
Evaluation by this method is intended to be nondestructive. For target
assemblies that would be
degraded by immersion in demineralized water, for example, for porous
target materials, the test
should be considered a destructive one.
This practice is applicable to bonding methods that use a filler
material to join the target and
backing plate. These include solder, epoxy, and braze bonds.
The values stated in inch-pound units are to be regarded as the
standard. The values given in
parentheses are for information only.
This standard does not purport to address all of the safety concerns,
if any, associated with its
use. It is the responsibility of the user of this standard to
establish appropriate safety and
health practices and determine the applicability of regulatory
limitations prior to use.
Keywords:
- backing plates
- bonding
- nondestructive testing
- sputtering
- targets
- thin films
- ultrasonic testing
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