ASME Co-Sponsors Nanotechnology Conference in Hong Kong
February 1, 2008 // Published as a news service by IHS
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The American Society of Mechanical Engineers (ASME) and the Micro and Nanotechnology Commercialization and Education Foundation (MANCEF) will host the second Integration and Commercialization of Micro and Nano-systems International Conference and Exhibition, June 3-5, 2008 at the Hong Kong University of Science and Technology in Kowloon, Hong Kong.
The conference will include presentations on the latest R&D trends in nanoscience and engineering. Experts from industry, academia and government will discuss materials characterization, multiscale manufacturing, heat transfer, optics and simulation tools for systems integration, among other technical subjects.
The conference also will cover best practices in bringing micro- and nanotechnology-based products to commercial markets, and explore opportunities for partnering and creating new businesses in Asia.
For more information, go to http://www.asmeconferences.org/MicroNano08/.
Source: American Society of Mechanical Engineers (ASME).