RoHS/WEEE News
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Amphenol Releases HDB3 Series High-Density Mother Board, Daughter Board Connectors Mar 24, 2008
Amphenol Aerospace expanded its board level product offerings with the release of HDB3, a high-density brush connector series.
NIST, EC Partner for Better Measurements, Standards Jan 21, 2008
Advancing the development and availability of international measurement standards between the U.S. and the nations of the European Union (EU) in the fields of chemistry, life sciences and emerging technologies, while helping ensure the safety and quality of goods sold in both markets, is the goal of an agreement between the European Commission (EC) Joint Research Center's (JRC's) Institute for Reference Materials and Measurements (IRMM) and the National Institute of Standards and Technology (NIST).
Frost: Gov't Regulations Boost Demand for Environmental Testing Instrumentation Jan 14, 2008
To meet the demands of regulations such as the Waste of Electrical and Electronic Equipment (WEEE) and Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS), companies are investing in analytical instrumentation and services for environmental testing.
ASTM Int'l Declarable Substance Committee Receives Access to Enhesa Database Nov 23, 2007
Members of ASTM International Committee F40 on Declarable Substances in Materials received free access to the Enhesa regulatory database that houses regulations related to declarable substances.
ATIS Releases RoHS-Compliant Standard for Structural Metals, Bus Bars, Fasteners - ATIS PP-0600009 Nov 9, 2007
The Alliance for Telecommunications Industry Solutions (ATIS) released ATIS PP-0600009.2007 - RoHS-Compliant Standard for Structural Metals, Bus Bars and Fasteners.
EC Starts Legal Action for RoHS/WEEE Violations Oct 19, 2007
The European Commission (EC) is taking legal action against eight member states for not properly transposing European Union (EU) legislation to tackle electrical and electronic equipment waste and the hazardous substances contained in such products.
ASTM Int'l to Develop Proposed Tin-Based Solder Alloys Standard - ASTM WK15434 Oct 19, 2007
Participation is being sought for the development of a proposed ASTM International standard, ASTM WK15434 - Test Method for Analysis of Tin-Based Solder Alloys Using Optical Emission Spectrometry.
WinSystems Introduces PC/104 ZigBee Support for Embedded Market Sep 28, 2007
WinSystems introduced its PCM-ZigBee board, a PC/104-compliant module that supports the Institute of Electrical and Electronics Engineers (IEEE) 802.15.4 standard for wireless communications.
Frost: RoHS Directive Creates Opportunity for SMT Equipment Segments Sep 25, 2007
As a result of the Restriction of Hazardous Substances (RoHS) directive, the entire electronics value chain is being impacted, according to Frost & Sullivan, including the suppliers of printed circuit boards (PCBs), electronic devices, solder paste and flux vendors, as well as assemblers of electronic equipment.
Frost: E. Europe Manufacturing Hotspot Spurs SMT Reflow Soldering Equipment Market Aug 21, 2007
Due to the rise of Asian countries as global manufacturing hubs, the changing regional landscape of the electronics industry has forced equipment manufacturers to radically rethink their business strategies.
Fujitsu Launches 200 GB 2.5 Inch 5400 RPM SATA HDD with Rotational Vibration Compensation Aug 3, 2007
Fujitsu Computer Products of America Inc. released the MHY2200BS series mobile hard disk drives (HDDs) targeted at industrial and enterprise applications such as blade servers, telecommunications, surveillance cameras, industrial PCs, point-of-sale (POS) systems, automatic teller machines (ATMs), robotics, entry-level servers, medical equipment and storage systems.
MEN Mikro Elektronik Issues Ethernet Card for Harsh, Mobile Applications Aug 2, 2007
The F211 Fast Ethernet interface card from MEN Mikro Elektronik targets applications in harsh and mobile environments.
Advanced Interconnections Releases Interposers for Lead-Free BGA Devices in Tin/Lead Reflow Profiles Jul 1, 2007
Advanced Interconnections introduced new ball grid array (BGA) interposers for converting lead-free BGA device packages for use on boards processed with lower temperature, tin/lead solder profiles.
UGS Publishes Five-Point Guide to Ensuring Compliance with WEEE Directive Jun 18, 2007
UGS PLM Software released a guide directed at ensuring Waste Electrical and Electronic Equipment (WEEE) directive-compliant practices are central to the product lifecycle in manufacturing organisations throughout Europe.
Freescale Designs LDMOS RF Power Transistors for Use with Doherty Amplifiers Jun 7, 2007
Freescale Semiconductor introduced seven laterally diffused metal oxide semiconductor radio frequency (LDMOS RF) power transistors that enable wideband code-division multiple access (WCDMA) and CDMA2000 base station transmitters to use the potential of the Doherty amplifier architecture.
ASTM Int'l Resolves RoHS, Hydrogen Embrittlement Issues in Revised Zinc Standard - ASTM B 633 May 1, 2007
ASTM International Committee B08 on Metallic and Inorganic Coatings approved a revision of one of its most important standards, ASTM B 633 - Specification for Electrodeposited Coatings of Zinc on Iron and Steel.
ATIS Evaluates Materials for Telecom Equipment, Infrastructure in Response to RoHS Apr 6, 2007
In a proactive response to the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive, the Alliance of Telecommunications Industry Solutions (ATIS) Network Interface, Power and Protection Committee (NIPP) is evaluating the impact of certain materials substitutes, such as those for leaded solder and hexavalent chromium, in telecommunications equipment and products.
3-Axis Accelerometer Miniaturizes Motion Sensing in Electronic Devices Feb 28, 2007
STMicroelectronics released a tiny, low-power micro-electro-mechanical (MEMS) device that provides acceleration values in all three dimensions and miniaturizes motion-sensing in portable electronic devices.
ARINC Introduces Solder Verification Program for DoD Depots, Electronic Repair Facilities Feb 26, 2007
ARINC Engineering Services unveiled a two-part solution designed to enable U.S. Department of Defense (DoD) manufacturers and supply chain managers to verify the solder composition on electronic parts and assemblies used in military and other high reliability applications.
ASTM Int'l Declarable Substances Guide - ASTM F 2577 - Offers Case Studies to Illustrate Assessment Process Jan 22, 2007
ASTM International Committee F40 on Declarable Substances in Materials approved its second standard, ASTM F 2577 - Guide for Assessment of Materials and Products for Declarable Substances.
Tin Whisker User Group Publishes Updated Set of Recommendations Jan 4, 2007
The International Electronics Manufacturing Initiative (iNEMI) Tin Whisker User Group released a major update of its publication, Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products.
EIA Announces Availability of China RoHS Translations, Analysis Jan 4, 2007
Frost: Increasing Electronic, Productivity Demands to Boost Wave Soldering Equipment Market in N. America Nov 7, 2006
With industries such as telecommunications, computing and automobiles increasingly thriving, the demand for wave soldering equipment has also grown.
IPC Lead Free Study Indicates Industry Dissatisfaction with Component Manufacturers Oct 31, 2006
IPC released Report on IPC Lead Free Preparedness Study, which provides insight on the current level of preparedness of 196 electronic end-product manufacturers or original equipment manufacturers (OEMs) and 94 electronics manufacturing services (EMS) companies worldwide and identifies major manufacturing issues and processes affecting lead free implementation.
Frost: Process Changes in Manufacturing Boost Demand for Reflow Soldering Equipment Oct 31, 2006
Despite lower wages and price pressures from overseas competitors, analysts said the reflow soldering equipment market in North America has bounced back, largely due to the adoption of lead-free solder paste.
NIST Examines Impact of Chemical Controls Sep 25, 2006
The costs of dealing with multiple chemical regulations and control requirements in different markets goes far beyond the chemical industry itself.
UL Qualifies Specialized Technology Resources as RoHS Testing Partner Jul 15, 2006
Underwriters Laboratories Inc. (UL) qualified Specialized Technology Resources Inc. (STR) in Turkey to perform testing for UL in accordance with the European Union (EU) RoHS directive.
FAQ on EU's Electrical and Electronic Waste (WEEE) Policies Jul 7, 2006
What is the problem with electrical and electronic waste?
| Top RoHS/WEEE Standards |
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AFNOR NF EN 50419
Marking Of Electrical And Electronic Equipment In Accordance With (WEEE)
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BSI BS EN 50419
Marking Of Electrical And Electronic Equipment In Accordance With Article 11(2) Of Directive 2002/96/EC |
BSI PD CLC/TR 50489
Smart Tracker Chips — Feasibility Study On The Inclusion Of Rfid In Electrical And Electronic Equipment For WEEE Management |
EU 2002/96/EC
Directive Of The European Parliament And Of The Council On Waste Electrical And Electronic Equipment |
ECA ECCB-954
Electrical And Electronic Components And Products Hazardous Substance Free Standard And Requirements |
EU 2005/618/EC
Commission Decision Amending Directive 2002/95/Ec Of The European Parliament And Of The Council For The Purpose Of Establishing The Maximum Concentration Values For Certain Hazardous Substances In Electrical And Electronic Equipment |
EU Begins Ban on Hazardous Substances in Electrical and Electronic Products Jul 7, 2006
A wide range of new electrical and electronic products will be disallowed in European Union (EU) markets after July 1, 2006 if they contain banned hazardous substances.
iNEMI Publishes Guidelines for Subassemblies in High-Reliability Applications Jul 4, 2006
The International Electronics Manufacturing Initiative (iNEMI) High-Reliability Restriction of Hazardous Substance (RoHS) Task Force published guidelines regarding assembly processes and reliability requirements for RoHS5 and RoHS6 subassembly modules.
Frost: WEEE Directive, Recycling Technology Advances, New Material Development Key to Successful E-waste Recovery Jul 3, 2006
The emerging field of electronic waste (e-waste) recovery is attracting increasing attention as governments of several developed countries issue directives - including the European Union (EU) WEEE (waste electrical and electronic equipment) legislation - to address the environmental hazards posed by existing disposal methods.
National Instruments Products Now RoHS-Compliant Jun 16, 2006
National Instruments (NI) announced the release of several products that comply with the NI Hazardous Substances Reduction initiative.
Hong Kong Productivity Council, Microsoft Launch RoHS Portal May 30, 2006
The implementation of the European Union (EU) Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) is expected to significantly impact Hong Kong manufacturers.
UL Supports European Union RoHS Compliance May 16, 2006
Underwriters Laboratories Inc. (UL) announced two new services designed for organizations seeking to demonstrate compliance with the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive, effective July 1, 2006.
DCA: China RoHS Scope Clarified May 9, 2006
In the article on Green Supplyline entitled "China to postpone RoHS legislation" we said that the MII would clarify the scope of what is now the "China RoHS" law. They have now done that, and it is something to behold.
DCA: Hazardous Materials in Electronic Components May 9, 2006
The European Union (EU) Directives on waste electrical and electronic equipment (WEEE) 2002/96/EC (as amended by 2003/108/EC) and on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) 2002/95/EC, among other things, restrict the use of certain hazardous substances in electrical and electronic equipment shipped in to the EU as of July 1, 2006 and require financing take-back/recycling as of August 13, 2005.
IPC Publishes Materials Declaration Management Standard Mar 28, 2006
The IPC-1752 - Materials Declaration Management standard helps companies track hazardous materials.
iNEMI Makes Recommendations for Pb-Free Manufacturing Requirements Mar 21, 2006
The International Electronics Manufacturing Initiative (iNEMI) High-Reliability Restriction of Hazardous Substances Directive (RoHS) Task Force published recommendations for lead (Pb)- free manufacturing of complex, thermally challenging electronic assemblies.
Lead-free Solder Licensed Worldwide as EU Rules Take Effect Mar 6, 2006
As a result of the Waste Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous Substances (RoHS) directives, the European Union (EU) will strictly limit the amount of lead and other hazardous materials within the circuitry of any electronic appliance sold, beginning July 1.
Materials Declaration Standard Helps Manufacturers Comply with RoHS Mar 1, 2006
The International Electronics Manufacturing Initiative (iNEMI) announced its members will implement IPC-1752 - Materials Declaration Management.
EU Hazardous Substances Directive Eases Contamination Concerns Feb 23, 2006
The European Parliament and the Council of the European Union (EU) initiated the Restriction of Hazardous Substances (RoHS) Directive to help protect human health and the environment from environmental contamination concerns.
European Commission Seeks RoHS/WEEE Stakeholder Consultation Oct 21, 2005
The European Commission issued a document reflecting a stakeholder consultation on scientific and technical progress under Directive 2002/95/EC of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment for the purpose of a possible amendment of the annex.
ASTM Int'l Tackles RoHS, Declarable Substances Technical Issues Aug 12, 2005
Technical issues with test methods and reference materials identified by ASTM International Committee F40 on Declarable Substances in Materials will be among the topics discussed at a workshop hosted by the National Institute of Standards and Technology (NIST) in October.
European Commission Issues FAQ For RoHS, WEEE Directives Jun 6, 2005
The European Commission Directorate-General of Environment issued a Frequently Asked Questions document intended to help authorities in member states interpret Directive 2002/95/EC on restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), and Directive 2002/96/EC on waste electrical and electronic equipment (WEEE).
ASTM Int'l Forms Declarable Substances in Materials Committee Apr 18, 2005
ASTM International formed a new committee to develop standards for the evaluation of materials and products targeted by restriction of certain hazardous substances regulations.
UL Program Designed for EU RoHS Compliance Nov 17, 2004
Underwriters Laboratories Inc., responding to the July 2006 effective date of the European Union Restriction of Hazardous Substances Directive for electronics manufacturers, announced a new program to help organizations meet the requirements of the directive.